Abstract: In one embodiment, the present invention includes a semiconductor package having a plurality of fan blades embedded within a first surface of the package, where a first group of the fan blades extend from a first side of the package and a second group of the fan blades extend from a second side of semiconductor package. The fan blades may be powered by piezoelectric devices to cause motion of the fan blades. Other embodiments are described and claimed.

Abstract: A configurable multi-faceted input/output (I/O) panel may be used in a computer or electronic device to present multiple I/O interfaces to a user. The configurable multi-faceted I/O panels may be configured by a user such that one of a plurality of different I/O faces is accessible to the user. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include a support member mounted on the same side of the circuit board as the heat generating component and extending around at least a portion of the component. The support member may include a circuit board mounting portion, a thermal management mounting portion and a side portion extending between the circuit board mounting portion and the thermal management mounting portion. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A method to couple a module to a board including power circuitry. The method includes detecting a module's power requirements before providing payload power to the module and routing a regulated power level to the module via at least one power feed based on the detected power requirements. The regulated power is provided by the board's power circuitry.

Abstract: An apparatus and system includes a radiation generation device for generating radiation and a radiation detection device. A first radiation channel is optically-coupled on a first end to the radiation generation device and configured to direct the radiation generated by the radiation generation device to a second end of the first radiation channel. A second radiation channel is optically-coupled on a first end to the radiation detection device and configured to direct radiation from a second end of the second radiation channel to the radiation detection device. An optical switch is configured to selectively interrupt the transmission of radiation from the second end of the first radiation channel to the second end of the second radiation channel.

Abstract: In one embodiment, the present invention includes a semiconductor package having a plurality of fan blades embedded within a first surface of the package, where a first group of the fan blades extend from a first side of the package and a second group of the fan blades extend from a second side of semiconductor package. The fan blades may be powered by piezoelectric devices to cause motion of the fan blades. Other embodiments are described and claimed.

Abstract: Rotating latching mechanism for securing Advanced Telecom Computing Architecture (ATCA) mezzanine card (AdvancedMC) modules within mezzanine slots on an ATCA carrier board. The rotating latching mechanism includes a rotating latching member having a handle coupled to a shaft to which a latching paddle and position detector actuator paddle are also coupled. The rotating latching member is pivotally coupled relative to a faceplate of a module proximate to the handle, and the shaft at the opposite end is supported by a rear bearing support member coupled to the modules circuit card. As the handle is rotated, the latching paddle is rotated to engage a cutout formed in a strut coupled to the ATCA carrier board, thus latching the module in place. The position detector actuator paddle is also rotated to cause a position detector to be actuated.

Abstract: A configurable multi-faceted input/output (I/O) panel may be used in a computer or electronic device to present multiple I/O interfaces to a user. The configurable multi-faceted I/O panels may be configured by a user such that one of a plurality of different I/O faces is accessible to the user. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A method according to one embodiment may include providing circuit board having a faceplate. The method of this embodiment may also include providing a label surface capable of moving between a deployed position and a stowed position. When the label surface is in a deployed position at least a portion of the label surface extends outwardly from the faceplate relative to the circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A folding latching mechanism and related structure. An embodiment of the folding latching mechanism includes a latch member having a claw-shaped clasp disposed proximate to a pivot member that enables a pivotal coupling about a first pivot axis. A lever arm is pivotally-coupled to the latch member about a second pivot (fold) axis that is perpendicular to the first pivot axis of the latch member. During use, the latch member is rotated about its first pivot axis via the lever arm in an extended position, whereby the latching member is securely coupled to a frame member via its clasp. The lever arm is then rotated about its fold axis and secured in place. The folding latching mechanism may be employed on an Advanced Telecom Computing Architecture (ATCA) board hosting one or more Advanced Mezzanine Card (AdvancedMC) modules, wherein the mechanism does not interfere with the I/O port interfaces for the modules.

Abstract: One or more components on one or more circuit boards in a chassis may be configured and/or oriented such that the component(s) are aligned with a diagonal predominant air flow path through the chassis. In one embodiment, components may be mounted on a circuit board with a skewed orientation that aligns the components with the predominant air flow path. In another embodiment, one or more heat sinks may include angled fins that are aligned with the predominant air flow path. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A two-dimensional adjustable edge connector adaptor to support high bandwidth signal paths. The edge connector adapter includes a housing having a cavity formed in one side and an edge connector extending outward from an opposing side. The edge connector includes contact members that are configured to function as conventional edge connector contacts on one end, while the opposing end includes a leg that is in contact with first side of an elastomer connector disposed in the cavity. The elastomer connector facilitates electrical coupling between each contact member and a corresponding board contact on a board having a connector edge that is inserted into the cavity, wherein each board contact includes a leg that is in contact with a second side of the elastomer connector. The adjustable edge connector adaptor enables the board to be positioned in both the horizontal and vertical directions relative to the edge connector.

Abstract: A method according to one embodiment may include providing a heat generating component disposed on a first side of a first circuit board, and transferring heat from the heat generating component through the first circuit board to a second side of the first circuit board. The method according to this embodiment may further include slidingly thermally coupling the second side of the first circuit board to a thermal solution disposed on a second circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include a support member mounted on the same side of the circuit board as the heat generating component and extending around at least a portion of the component. The support member may include a circuit board mounting portion, a thermal management mounting portion and a side portion extending between the circuit board mounting portion and the thermal management mounting portion. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A method to couple a module to a board including power circuitry. The method includes detecting a module's power requirements before providing payload power to the module and routing a regulated power level to the module via at least one power feed based on the detected power requirements. The regulated power is provided by the board's power circuitry.

Abstract: An apparatus and system includes a radiation generation device for generating radiation and a radiation detection device. A first radiation channel is optically-coupled on a first end to the radiation generation device and configured to direct the radiation generated by the radiation generation device to a second end of the first radiation channel. A second radiation channel is optically-coupled on a first end to the radiation detection device and configured to direct radiation from a second end of the second radiation channel to the radiation detection device. An optical switch is configured to selectively interrupt the transmission of radiation from the second end of the first radiation channel to the second end of the second radiation channel.

Abstract: A method according to one embodiment may include providing a heat generating component disposed on a first side of a first circuit board, and transferring heat from the heat generating component through the first circuit board to a second side of the first circuit board. The method according to this embodiment may further include slidingly thermally coupling the second side of the first circuit board to a thermal solution disposed on a second circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A folding latching mechanism and related structure. An embodiment of the folding latching mechanism includes a latch member having a claw-shaped clasp disposed proximate to a pivot member that enables a pivotal coupling about a first pivot axis. A lever arm is pivotally-coupled to the latch member about a second pivot (fold) axis that is perpendicular to the first pivot axis of the latch member. During use, the latch member is rotated about its first pivot axis via the lever arm in an extended position, whereby the latching member is securely coupled to a frame member via its clasp. The lever arm is then rotated about its fold axis and secured in place. The folding latching mechanism may be employed on an Advanced Telecom Computing Architecture (ATCA) board hosting one or more Advanced Mezzanine Card (AdvancedMC) modules, wherein the mechanism does not interfere with the I/O port interfaces for the modules.

Abstract: A two-dimensional adjustable edge connector adaptor to support high bandwidth signal paths. The edge connector adapter includes a housing having a cavity formed in one side and an edge connector extending outward from an opposing side. The edge connector includes contact members that are configured to function as conventional edge connector contacts on one end, while the opposing end includes a leg that is in contact with first side of an elastomer connector disposed in the cavity. The elastomer connector facilitates electrical coupling between each contact member and a corresponding board contact on a board having a connector edge that is inserted into the cavity, wherein each board contact includes a leg that is in contact with a second side of the elastomer connector. The adjustable edge connector adaptor enables the board to be positioned in both the horizontal and vertical directions relative to the edge connector.

Abstract: Rotating latching mechanism for securing Advanced Telecom Computing Architecture (ATCA) mezzanine card (AdvancedMC) modules within mezzanine slots on an ATCA carrier board. The rotating latching mechanism includes a rotating latching member having a handle coupled to a shaft to which a latching paddle and position detector actuator paddle are also coupled. The rotating latching member is pivotally coupled relative to a faceplate of a module proximate to the handle, and the shaft at the opposite end is supported by a rear bearing support member coupled to the modules circuit card. As the handle is rotated, the latching paddle is rotated to engage a cutout formed in a strut coupled to the ATCA carrier board, thus latching the module in place. The position detector actuator paddle is also rotated to cause a position detector to be actuated.