Patents by Inventor William Harold King

William Harold King has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT TRANSFER DEVICE HAVING 3-DIMENSIONAL PROJECTIONS AND AN ASSOCIATED METHOD OF FABRICATION
    Publication number: 20150090428
    Abstract: A heat transfer device filled with a working fluid, includes a casing and a wick disposed within the casing. The wick includes a first sintered layer, a second sintered layer, and a third sintered layer. The first sintered layer is disposed proximate to an inner surface of the casing and the second sintered layer is disposed on the first sintered layer. The second sintered layer includes a first set of 3-dimensional sintered projections and a second set of 3-dimensional sintered projections disposed along a portion of the wick. Further, the third sintered layer is disposed on at least a portion of the second sintered layer. The heat transfer device includes at least one first sintered particle of the first sintered layer, which is smaller in size than at least one second pore of the second sintered layer.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Applicant: General Electric Company
    Inventors: Shakti Singh Chauhan, Joo Han Kim, William Harold King, Pramod Chamarthy, Tao Deng
  • HEAT TRANSFER DEVICE AND AN ASSOCIATED METHOD OF FABRICATION
    Publication number: 20150060021
    Abstract: A heat transfer device includes a casing and a wick disposed within the casing. The wick includes a first sintered layer and a second sintered layer. The first sintered layer includes a plurality of first sintered particles, having a first porosity and a plurality of first pores. The first sintered layer is disposed proximate to an inner surface of the casing. The second sintered layer includes a plurality of second sintered particles, having a second porosity and a plurality of second pores. The second sintered layer is disposed on the first sintered layer. The heat transfer device includes at least one first sintered particle smaller than at least one second pore and the first porosity is smaller than the second porosity.
    Type: Application
    Filed: September 5, 2013
    Publication date: March 5, 2015
    Applicant: General Electric Company
    Inventors: Shakti Singh Chauhan, William Harold King, Stanton Earl Weaver, JR., Binoy Milan Shah, Tao Deng