Patents by Inventor William Harrigan

William Harrigan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10581151
    Abstract: Provided are stacks including CMC structures and capping layers deposited on surfaces of these CMC structures. Also provided are methods for hermetically sealing the surfaces of the CMC structures with the capping layers. These stacks may be used to construct walls of radomes that enclose antennas and other equipment of aerospace vehicles. The capping layers may form smooth external surfaces of the radomes and may hermetically seal the underlying CMC structures. The dielectric properties of these stacks may be configured to minimize interference with operations of the antennas and other equipment deposited within the radome.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: March 3, 2020
    Assignee: The Boeing Company
    Inventors: Robert A. DiChiara, MaryAnn S. Muench, William Harrigan, Kevin R. Lenihan
  • Publication number: 20190288384
    Abstract: Provided are stacks including CMC structures and capping layers deposited on surfaces of these CMC structures. Also provided are methods for hermetically sealing the surfaces of the CMC structures with the capping layers. These stacks may be used to construct walls of radomes that enclose antennas and other equipment of aerospace vehicles. The capping layers may form smooth external surfaces of the radomes and may hermetically seal the underlying CMC structures. The dielectric properties of these stacks may be configured to minimize interference with operations of the antennas and other equipment deposited within the radome.
    Type: Application
    Filed: May 28, 2019
    Publication date: September 19, 2019
    Applicant: The Boeing Company
    Inventors: Robert A. DiChiara, MaryAnn S. Muench, William Harrigan, Kevin R. Lenihan
  • Patent number: 10347982
    Abstract: Provided are methods for hermetically sealing the surfaces of the CMC structures with the capping layers, comprising depositing a slurry onto the surface of a CMC structure and treating the CMC structure with the deposited slurry in an oxygen containing environment, thereby forming a stack. These stacks may be used to construct walls of radomes that enclose antennas and other equipment of aerospace vehicles. The capping layers may form smooth external surfaces of the radomes and may hermetically seal the underlying CMC structures. The dielectric properties of these stacks may be configured to minimize interference with operations of the antennas and other equipment deposited within the radome.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: July 9, 2019
    Assignee: The Boeing Company
    Inventors: MaryAnn S. Muench, Robert A. DiChiara, William Harrigan, Kevin R. Lenihan
  • Publication number: 20160336650
    Abstract: Provided are stacks including CMC structures and capping layers deposited on surfaces of these CMC structures. Also provided are methods for hermetically sealing the surfaces of the CMC structures with the capping layers. These stacks may be used to construct walls of radomes that enclose antennas and other equipment of aerospace vehicles. The capping layers may form smooth external surfaces of the radomes and may hermetically seal the underlying CMC structures. The dielectric properties of these stacks may be configured to minimize interference with operations of the antennas and other equipment deposited within the radome.
    Type: Application
    Filed: July 15, 2016
    Publication date: November 17, 2016
    Applicant: The Boeing Company
    Inventors: MaryAnn S. Muench, Robert A. DiChiara, William Harrigan, Kevin R. Lenihan
  • Patent number: 9419333
    Abstract: Provided are stacks including CMC structures and capping layers deposited on surfaces of these CMC structures. Also provided are methods for hermetically sealing the surfaces of the CMC structures with the capping layers. These stacks may be used to construct walls of radomes that enclose antennas and other equipment of aerospace vehicles. The capping layers may form smooth external surfaces of the radomes and may hermetically seal the underlying CMC structures. The dielectric properties of these stacks may be configured to minimize interference with operations of the antennas and other equipment deposited within the radome.
    Type: Grant
    Filed: April 10, 2014
    Date of Patent: August 16, 2016
    Assignee: The Boeing Company
    Inventors: MaryAnn S. Muench, Robert A. DiChiara, William Harrigan, Kevin R. Lenihan
  • Publication number: 20050106056
    Abstract: A manufacturing method for producing metal matrix composite (MMC) sheets without intermediate process losses associated with extrusion and rolling edge cracks. The method results in theoretical sheet yield rates from the initial MMC billet of up to 100%, compared to 30 to 60% yield rates for prior-art manufacturing processes. The methods in this invention comprise the following processes: (a) preparing a MMC powder mixture; (b) preparing a frame and a billet consolidation tool; (c) loading and compacting the MMC mixture to form a framed MMC compact; (d) consolidation of the framed MMC compact to form a framed MMC billet; (e) preparing the framed billet to be a framed roll-preform; and (e) rolling the framed roll-preform to MMC sheet.
    Type: Application
    Filed: November 18, 2003
    Publication date: May 19, 2005
    Inventors: Jack Peng, Mark van den Bergh, William Harrigan