Patents by Inventor William Harwell

William Harwell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4685512
    Abstract: A thermal management system using heat pipe principles and incorporating capillary-pumped equipment mounting panels such that a heat transport loop without moving parts is provided. The panels can function to either absorb heat or to reject heat and can interface with heat generating equipment or heat radiators. Each panel comprises a pair of coextensive flat plates bonded together with a thin, fine-pore sheet wick interposed therebetween. A network of liquid grooves in one plate is in fluid communication with the sheet wick which covers the grooves and most of the plate and a separate liquid line connecting the panels. A network of vapor channels in the other plate is in fluid communication with the wick and with a separate vapor line connecting the panels. The vapor channel networks of the panels and the liquid groove networks of the panels are connected such that the panels are arranged in parallel in the fluid circuit or loop.
    Type: Grant
    Filed: July 24, 1986
    Date of Patent: August 11, 1987
    Assignee: Grumman Aerospace Corporation
    Inventors: Fred Edelstein, Robert A. Haslett, Robert L. Kosson, William Harwell
  • Patent number: 4609035
    Abstract: A cylindrically hollow segmented thermal gradient furnace enclosing metal or semiconductor material wherein each segment includes a heater for raising the temperature of the metal. The material is encircled by a heat pipe which is coupled to a heat exchanger for rapidly cooling a corresponding segment of the material after the heater has performed a thermal soak of the material. A reservoir is filled with inert gas which is selectively expanded to block cooling at the heat exchanger when the heater is turned on and compressed to allow cooling at the exchanger when the heater is turned off so that a sharp thermal gradient may be established along the length of the material.
    Type: Grant
    Filed: February 26, 1985
    Date of Patent: September 2, 1986
    Assignee: Grumman Aerospace Corporation
    Inventors: Robert Haslett, William Harwell
  • Patent number: 4602679
    Abstract: A thermal management system using heat pipe principles and incorporating capillary-pumped equipment mounting panels such that a heat transport loop without moving parts is provided. The panels can function to either absorb heat or to reject heat and can interface with heat generating equipment or heat radiators. Each panel comprises a pair of coextensive flat plates bonded together with a thin, fine-pore sheet wick interposed therebetween. A network of liquid grooves in one plate is in fluid communication with the sheet wick which covers the grooves and most of the plate and a separate liquid line connecting the panels. A network of vapor channels in the other plate is in fluid communication with the wick and with a separate vapor line connecting the panels. The vapor channel networks of the panels and the liquid groove networks of the panels are connected such that the panels are arranged in parallel in the fluid circuit or loop.
    Type: Grant
    Filed: March 22, 1982
    Date of Patent: July 29, 1986
    Assignee: Grumman Aerospace Corporation
    Inventors: Fred Edelstein, Robert A. Haslett, Robert L. Kosson, William Harwell