Abstract: A structural assembly and an associated system and method for manufacture are provided. The structural assembly includes an elongate member and a first connector member that is connected to an end of the elongate member by a braze joint. A second connector member can be connected to an end of the elongate member opposite the first connector by another braze joint. The elongate member is formed of a metal matrix composite material that includes a plurality of fibers of a reinforcement material disposed in a metal matrix. Each connector member is formed of a material that is dissimilar to the material of the elongate member. The braze joints can be formed by selectively heating the braze material, e.g., with an inductive coil that extends circumferentially around only a portion of the structural assembly.

Abstract: A receptacle for receiving a module and electrically connecting said module to a host circuit board mounted within a chassis of a host system, said chassis having a bezel opening which has an offset a certain distance above said host circuit board: (a) a housing having a front, a back wall, a top wall, a bottom wall, and side walls and defining a cavity for receiving a module, the bottom wall having a bottom opening to receive a receptacle connector, the front having a front opening to receive the module, the walls comprising a conductive material; (b) a plurality of elongated members extending down from the housing past the bottom wall and adapted for electrical connection to a host circuit board such that the walls are electrically connected to the host circuit board; and (c) at least one standoff extending down from the housing, the standoff being more toward the front of the housing than the rear, when the housing is mounted to the host circuit board, the standoff contacts the circuit board and causes the

Abstract: A receptacle for receiving a module and electrically connecting said module to a host circuit board mounted within a chassis of a host system, said chassis having a bezel which has an offset a certain distance above said host circuit board: (a) a housing having a front, a back wall, a top wall, a bottom wall, and side walls and defining a cavity for receiving a module, the bottom wall having a bottom opening to receive a receptacle connector, the front having a front opening to receive the module, the walls comprising a conductive material; (b) a plurality of elongated members extending down from the housing past the bottom wall and adapted for electrical connection to a host circuit board such that the walls are electrically connected to the host circuit board; and (c) at least one standoff extending down from the housing, the standoff being more toward the front of the housing than the rear, when the housing is mounted to the host circuit board, the standoff contacts the circuit board and causes the front o

Abstract: Disclosed is a packaged antiperspirant cream composition comprising a gellant, a liquid carrier, an antiperspirant active, and a dispensing package which contains the antiperspirant cream composition. The packaged antiperspirant cream compositions have improved stability, application aesthetics, and reduced syneresis.