Patents by Inventor William Hesse

William Hesse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11625793
    Abstract: A process for estimating a value of a crop of walnuts prior to harvest includes the following steps which are not necessarily in order. First, arranging an unmanned aerial vehicle with a digital single-lens reflex high speed multi spectral camera fitted with a near-infrared filter. Then, taking normalized difference vegetation index images of a field of walnuts every second at a clarity of two centimeters in detail from an altitude of four hundred feet. Next, forming a map of the field from the normalized difference vegetation index images. After that, determining a ratio of the field which possesses a high near-infrared profile. Following that, calculating a meat yield as a product of the ratio and the maximum walnut grade in the field. Finally, calculating the value of the crop from the meat yield.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: April 11, 2023
    Inventors: Meyer Colpien Hesse, Travis William Hesse
  • Publication number: 20140057285
    Abstract: In some aspects, the invention provides chimeric kinesin proteins. In other aspects the invention provides nucleic acids encoding chimeric kinesin proteins. Compositions and kits are provided that comprise chimeric kinesin proteins and nucleic acids encoding the same. Antibodies and antigen binding fragments that selectively bind kinesin proteins are also provided.
    Type: Application
    Filed: March 5, 2012
    Publication date: February 27, 2014
    Inventors: Matthew J. Lang, William Hesse, Wonmuk Hwang, Martin Karplus
  • Patent number: 7517579
    Abstract: A bonded structure including one or more substrates bonded together with a tackified amorphous poly-alpha-olefin adhesive composition. One method of making such a bonded structure is carried out by applying a tackified amorphous poly-alpha-olefin adhesive composition to one or more substrates at a temperature of about 170 degrees Celsius or lower, and joining the substrates to themselves or to one another. The bonded structure has a dynamic peel strength between about 400 and about 1000 grams per 25 millimeters. The bonding efficiency of the bonded structure renders the bonded structure suitable for incorporation into a variety of articles, including personal care products, health/medical products, and household/industrial product, for example.
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: April 14, 2009
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Stephen Michael Campbell, Daniel William Hesse, Richard D. Schultz, Mark J. Jung, Richard M. Hansen, Cristian M. Neculescu, Sandra Marie Rogers, Violet May Grube, Rhiannon L. Thoresen, Thomas Michael Killian, Jonathan K. Rice, Palani Raj Ramaswami Wallajapet, Courtney Eileen Shea, Jason Sybren Fairbanks, Prasad Shrikrishna Potnis, Randall J. Palmer
  • Patent number: 7270889
    Abstract: A bonded structure including one or more substrates bonded together with a tackified amorphous poly-alpha-olefin adhesive composition. One method of making such a bonded structure is carried out by applying a tackified amorphous poly-alpha-olefin adhesive composition to one or more substrates at a temperature of about 170 degrees Celsius or lower, and joining the substrates to themselves or to one another. The bonded structure has a dynamic peel strength between about 400 and about 1000 grams per 25 millimeters. The bonding efficiency of the bonded structure renders the bonded structure suitable for incorporation into a variety of articles, including personal care products, health/medical products, and household/industrial product, for example.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: September 18, 2007
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Stephen Michael Campbell, Daniel William Hesse, Richard D. Schultz, Mark J. Jung, Richard M. Hansen, Cristian M. Neculescu, Sandra Marie Rogers, Violet May Grube, Rhiannon L. Thoresen, Thomas Michael Killian, Jonathan K. Rice, Palani Raj Ramaswami Wallajapet, Courtney Eileen Shea, Jason Sybren Fairbanks, Prasad Shrikrishna Potnis, Randall J. Palmer