Abstract: At least one implementation provides a hold down for an electronic device. The electronic device includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad. The hold down includes a generally planar portion adapted to be positioned over a surface of the heat sink. The hold down also includes a plurality of connecting structures extending angularly from the generally planar portion. The connecting structures and configured to engage the support frame to cause the hold down to apply the biasing force to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame. A method is also provided for attaching the hold down.

Abstract: An electronic device is provided that includes a vertical chassis wall having an aperture; a horizontal circuit board that extends toward the vertical chassis wall; an F-connector connected to the horizontal circuit board on a first side and extending out of the vertical chassis wall through the aperture; and an inner shield that shields a radiofrequency circuit components mounted on the first side of the circuit board. The inner shield includes tabs that extend partially into solder plated clearance holes in the horizontal circuit board and are reflow-soldered into the clearance holes. The tabs have distal ends that terminate between a plane of the first side and a plane of a second side of the circuit board.

Abstract: An electronic device is provided that has a vertical chassis wall with an aperture, a horizontal circuit board that extends toward the vertical chassis wall, F-connector connected to the horizontal circuit board and extending out of the a vertical chassis wall through the aperture and dual height inner RF shield that covers part of the F-connector and other electronic components. The height of the RF is greater over the F-connector than over some of the other electronic components.

Abstract: A hold down for an electronic device is provided that includes a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, and a heat sink associated with the thermal pad. The hold down includes a frame that defines a perimeter having a plurality of retainers that are configured to engage with a plurality of mating locations defined on at least a bottom frame to provide a biasing force that retains the heat sink against a circuit board that is positioned between the bottom frame and the hold down.

Abstract: An electronic device is provided that comprises a bottom frame portion; an information card reader over the bottom frame portion; a thermal insulation layer; a circuit board over the thermal insulation layer; a top broad heat sink over the circuit board; and a top cover over the top broad heat sink.

Abstract: At least one implementation provides a hold down for an electronic device. The electronic device includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad. The hold down includes a generally planar portion adapted to be positioned over a surface of the heat sink. The hold down also includes a plurality of connecting structures extending angularly from the generally planar portion. The connecting structures and configured to engage the support frame to cause the hold down to apply the biasing force to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame. A method is also provided for attaching the hold down.

Abstract: A hold down for an electronic device is provided that includes a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, and a heat sink associated with the thermal pad. The hold down includes a frame that defines a perimeter having a plurality of retainers that are configured to engage with a plurality of mating locations defined on at least a bottom frame to provide a biasing force that retains the heat sink against a circuit board that is positioned between the bottom frame and the hold down.

Abstract: An electronic device is provided that comprises a bottom frame portion; an information card reader over the bottom frame portion; a thermal insulation layer; a circuit board over the thermal insulation layer; a top broad heat sink over the circuit board; and a top cover over the top broad heat sink.

Abstract: A gimbal mounted multifunction button has a selector button that can selectively actuate one or more microswitches in response to a biasing force. The multifunction button has a selector button mounted to a gimbal contained in a plate. The selector button has a plurality of protruding actuators that pass through the plate and align with a plurality of microswitches mounted to a printed circuit board. The selector button may be biased to selectively cause one of the of actuators to actuate a corresponding switch, or alternately selectively cause an adjacent pair of actuators to actuate a corresponding pair of adjacent switches.

Abstract: A button assembly has at least one button that can selectively actuate one or more microswitches mounted to a printed circuit board in response to a biasing force. The at least one button is coupled to a plate comprising a loading member. The loading member is in contact with a housing. The housing has a plurality of latches which engage the printed circuit board, holding the button assembly together.