Patents by Inventor William Hollender

William Hollender has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layered printed circuit board having core layers including indicia
    Patent number: 9572257
    Abstract: A printed circuit board (PCB) includes a stack of core layers disposed one over another, and electrically conductive interconnects extending vertically in the stack. Each of the core layers includes a substrate having opposite major surfaces, an electrically conductive active trace extending along at least one of the major surfaces, and an indicium. The stack also has an exposed edge where the indicia of the layers are together revealed. The indicia provide identifying and/or fiducial information about the PCB.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: February 14, 2017
    Assignee: Keysight Technologies, Inc.
    Inventors: Brian Wade Carlson, William Hollender, Donald Ingram
  • MULTI-LAYERED PRINTED CIRCUIT BOARD HAVING CORE LAYERS INCLUDING INDICIA
    Publication number: 20160037637
    Abstract: A printed circuit board (PCB) includes a stack of core layers disposed one over another, and electrically conductive interconnects extending vertically in the stack. Each of the core layers includes a substrate having opposite major surfaces, an electrically conductive active trace extending along at least one of the major surfaces, and an indicium. The stack also has an exposed edge where the indicia of the layers are together revealed. The indicia provide identifying and/or fiducial information about the PCB.
    Type: Application
    Filed: July 31, 2014
    Publication date: February 4, 2016
    Inventors: Brian Wade Carlson, William Hollender, Donald Ingram