Patents by Inventor William Hsiu

William Hsiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4632589
    Abstract: A solder-free circuit base plate made by changing the two integrated halves of conventional circuit base plate to two separate pieces side-exchangeably and removably joined by means of butterfly tenons and mortises made in the edges of different width so that different spaces and distances between the inserting holes can be arranged for making full use of the inserting holes and for inserting of different sizes of electronic parts in addition to the round hole design which smooths the insertion, prevents the hole from deforming and enhances the efficiency.
    Type: Grant
    Filed: November 25, 1985
    Date of Patent: December 30, 1986
    Inventor: William Hsiu