Abstract: A ganged saw blade assembly for dicing of wafers includes a plurality of circular saw blades positioned along a common central axis and erodible pitch spacers positioned along the common central axis between adjacent saw blades. The pitch spacers are eroded to a desired diameter relative to the common central axis to maintain a desired saw exposure, e.g. by sawing into an abrasive material with the saw blade assembly. The saw blade assembly thus permits use of the saw blades over longer periods notwithstanding erosion of the blades.

Abstract: An improved coolant manifold assembly is provided for supplying liquid coolant to the working surface of a cutting or grinding wheel in the course of a machine tool cutting or grinding operation. The coolant manifold assembly is adjustably mounted by a support frame onto a machine housing and includes a manifold unit having a coolant discharge nozzle disposed in relatively close association with a rotatable cutting wheel or wheels or the like. The manifold unit is supported from the frame by a first slide member which is adjustable to select the position of the discharge nozzle relative to the cutting wheel. In addition, the manifold unit supports an absorbent pad wetted with coolant and protruding into direct contact with the cutting wheel at a position generally adjacent the coolant discharge nozzle. A second slide member carries the absorbent pad for adjustment of pad position relative to the coolant discharge nozzle.