Abstract: A device includes: housing having top surface, bottom surface, and at least one side surface connected between top surface and bottom surface; a load cell positioned within housing; flexible section positioned within at least one of bottom surface or top surface of housing; rigid section positioned within flexible section, rigid section having opening surrounded by rigid material; rigid support having first end, second end, and center section; wherein first end of rigid support is positioned within housing and coupled to load cell; and wherein center section of rigid support passes through opening in rigid section positioned within flexible section, wherein center section of rigid support contacts rigid material of rigid section surrounding opening, wherein second end of rigid support is outside of housing.

Abstract: A frame having a perimeter defines a planar opening. A set of louvers may span from a first edge of the opening to a second edge of the opening. Each louver may be capable of rotating between a closed position and an open position. A set of physical obstructions may prevent the louvers from rotating beyond the open position. Each louver may be offset from the planar opening by a first acute angle when in a closed position, and by a second, larger, acute angle when in the open position. A flow of air in a first direction through the opening may rotate the set of louvers to the closed position. A flow air in the opposite direction through the opening may rotate the set of louvers to the open position such that the flow of air in the opposite direction moves freely through the opening.

Abstract: A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.

Abstract: Method and system for providing cooling to an electronics enclosure that includes redundant cooling in the event of a failure of a cooling fan. The system includes an enclosure configured to support electrical components and a fan chassis. The system also includes a plurality of cooling fans coupled to the fan chassis. Each of the plurality of cooling fans is rotatable relative to the fan chassis between a first orientation in which the fans are operable to direct air into the enclosure and a second orientation. Spacing between adjacent cooling fans is less when the second cooling fan is in the second orientation than when the second cooling fan is in the first orientation. A third one of the plurality of cooling fans automatically rotates from the second orientation to the first orientation upon the second cooling fan moving to the second orientation.

Abstract: A microfluidic control apparatus, such as a relief valve, includes a pressure containing housing to contain a fluid within an interior of the pressure containing housing, and a nanotube in fluid communication between the interior of the pressure containing housing and an exterior of the pressure containing housing. The nanotube is used to contain water therein such that, below a predetermined temperature, the water within the nanotube prevents pressure relief through the nanotube from the interior to the exterior of the pressure containing housing, and above the predetermined temperature, the water within the nanotube enables pressure relief through the nanotube from the interior to the exterior of the pressure containing housing.

Abstract: A microfluidic control apparatus, such as a relief valve, includes a pressure containing housing to contain a fluid within an interior of the pressure containing housing, and a nanotube in fluid communication between the interior of the pressure containing housing and an exterior of the pressure containing housing. The nanotube is used to contain water therein such that, below a predetermined temperature, the water within the nanotube prevents pressure relief through the nanotube from the interior to the exterior of the pressure containing housing, and above the predetermined temperature, the water within the nanotube enables pressure relief through the nanotube from the interior to the exterior of the pressure containing housing.

Abstract: An airflow sensor for a heat sink has a substantially flat base portion and a deformable upper portion electrically coupled to the base portion that contacts a conductive strip. As airflow increases, the deformable upper portion deforms and moves away from the source of airflow, which moves the point of contact between the deformable upper portion and the conductive strip farther away from the source of the airflow. The difference in the point of contact is measured, and is used to characterize the airflow sensor for different airflows. Data from the airflow sensor can then be logged during system operation. When needed, the data from the airflow sensor can be read from the log and converted to airflow using the airflow sensor characterization data. In this manner the airflow through a heat sink may be dynamically measured, allowing analysis and correlation between system events and airflow through the heat sink.

Abstract: A system which provides redundant cooling of heat generating components within an electronic system with a single row of fans out the use of counter-rotational fans or multiple rows of fan by displacing failed fans in orthogonal directions. The system includes a fan track that has an orthogonal portion and at least one parallel portion. A failed or failing fan is moved from the orthogonal portion of the fan track to the parallel portion of the fan track. A bank of fans are each upon the orthogonal portion of the track. Each fan in the bank of fans acts upon air to produce an airflow. The bank of fans includes a moved fan at least partially filling a void upon the orthogonal portion of the fan track that is created when the failed or failing fan was moved from the orthogonal portion of the fan track to the parallel portion of the fan track.

Abstract: A frame having a perimeter defines a planar opening. A set of louvers may span from a first edge of the opening to a second edge of the opening. Each louver may be capable of rotating between a closed position and an open position. A set of physical obstructions may prevent the louvers from rotating beyond the open position. Each louver may be offset from the planar opening by a first acute angle when in a closed position, and by a second, larger, acute angle when in the open position. A flow of air in a first direction through the opening may rotate the set of louvers to the closed position. A flow air in the opposite direction through the opening may rotate the set of louvers to the open position such that the flow of air in the opposite direction moves freely through the opening.

Abstract: A cooling system that includes two or more fans that each have a chassis. The chassis includes a first face, a second face, and a sidewall. The fans then can be attached to each other by attaching a sidewall of a first fan chassis to a sidewall of a second fan chassis. An adjustable vane is attached perpendicularly and approximately equidistant between the fans, with an angular control element that is attached to the first fan chassis. The vane can be oriented such that the vane divides the airflow distributed to the fans. The vane then can be adjusted radially by the angular control element, which is attached to the fan chassis. If an impeller of a fan chassis fails the vane can be adjusted radially using an angular control element to distribute more airflow to the failed fan superimposing the non-failed fan chassis.

Abstract: Aspects of the disclosure generally relate to lids for water bottles and water bottles having the same. The lid includes a lid body, a mouth piece coupled to the lid body, and a valve formed in the lid body. The valve is actuatable to selectively allow fluid flow therethrough. The disclosed water bottles include the preceding lid. The disclosed water bottles can be filled with a fluid without removing a lid from the water bottles.

Abstract: A frame having a perimeter defines a planar opening. A set of louvers may span from a first edge of the opening to a second edge of the opening. Each louver may be capable of rotating between a closed position and an open position. A set of physical obstructions may prevent the louvers from rotating beyond the open position. Each louver may be offset from the planar opening by a first acute angle when in a closed position, and by a second, larger, acute angle when in the open position. A flow of air in a first direction through the opening may rotate the set of louvers to the closed position. A flow air in the opposite direction through the opening may rotate the set of louvers to the open position such that the flow of air in the opposite direction moves freely through the opening.

Abstract: An airflow sensor for a heat sink has a first portion having a first electrical point of contact, a second portion have a second electrical point of contact, and a deformable portion made of an electroactive material electrically coupled to the first and second portions. The deformable portion has first electrical properties measured between the first and second electrical points of contact when there is no airflow and the deformable portion is in a first position, and has second electrical properties different than the first electrical properties when a source of airflow blows air against the deformable portion, thereby causing the deformable portion to extend to a second position farther away from the source of airflow than the first position. The airflow sensor can be incorporated into a heat sink for an electronic component.

Abstract: Enhanced cooling for electronic components within a computing device is provided. Blowers are preferably leveraged as air movers, and an airflow deflection surface (preferably configured as a ramp) is disposed within a plenum to guide airflow under an electronic component (such as a hard disk drive or solid state drive), the electronic component being placed in an inverted alignment whereby a surface having a higher heat transfer rate is facing down (toward the blower), and then into an intake of the blower. Air output from the blower may then pass into a downstream plenum formed at least in part by the blower, an inverted downstream electronic component, and a support member thereof, thus providing serial cooling of the downstream component. Anti-recirculation flaps are preferably disposed at the air output of the blower.

Abstract: A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.

Abstract: A cooling system that includes two or more fans that each have a chassis. The chassis includes a first face, a second face, and a sidewall. The fans then can be attached to each other by attaching a sidewall of a first fan chassis to a sidewall of a second fan chassis. An adjustable vane is attached perpendicularly and approximately equidistant between the fans, with an angular control element that is attached to the first fan chassis. The vane can be oriented such that the vane divides the airflow distributed to the fans. The vane then can be adjusted radially by the angular control element, which is attached to the fan chassis. If an impeller of a fan chassis fails the vane can be adjusted radially using an angular control element to distribute more airflow to the failed fan superimposing the non-failed fan chassis.

Abstract: A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.

Abstract: A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.

Abstract: Method and system for providing cooling to an electronics enclosure that includes redundant cooling in the event of a failure of a cooling fan. The system includes an enclosure configured to support electrical components and a fan chassis. The system also includes a plurality of cooling fans coupled to the fan chassis. Each of the plurality of cooling fans is rotatable relative to the fan chassis between a first orientation in which the fans are operable to direct air into the enclosure and a second orientation. Spacing between adjacent cooling fans is less when the second cooling fan is in the second orientation than when the second cooling fan is in the first orientation. A third one of the plurality of cooling fans automatically rotates from the second orientation to the first orientation upon the second cooling fan moving to the second orientation.

Abstract: Aspects of the disclosure generally relate to lids for water bottles and water bottles having the same. The lid includes a lid body, a mouth piece coupled to the lid body, and a valve formed in the lid body. The valve is actuatable to selectively allow fluid flow therethrough. The disclosed water bottles include the preceding lid. The disclosed water bottles can be filled with a fluid without removing a lid from the water bottles.