Abstract: Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.

Abstract: An insulated spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The insulated spray cooling system for extreme environments includes an insulated enclosure that isolates the electronic devices being thermally managed from the external environment and a thermal management unit within the enclosure for thermally managing electronic devices.

Abstract: Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.

Abstract: Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.

Abstract: Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.

Abstract: A spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The spray cooling system for extreme environments includes an enclosure that isolates the electronic components from the external environment, a spray unit within the enclosure for thermally managing one or more electronic devices, a pump unit fluidly connected to the spray unit, a heat exchanger unit fluidly connected to the pump, and a control valve fluidly connected between the heat exchanger unit and the pump. An independent chamber preferably houses a heater unit, a first power supply and a control unit, whereby the heater unit initially heats the coolant within the independent chamber to a minimum operating temperature prior to operation of the electronic components.

Abstract: A spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The spray cooling system for extreme environments includes an enclosure that isolates the electronic components from the external environment, a spray unit within the enclosure for thermally managing one or more electronic devices, a pump unit fluidly connected to the spray unit, a heat exchanger unit fluidly connected to the pump, and a control valve fluidly connected between the heat exchanger unit and the pump. An independent chamber preferably houses a heater unit, a first power supply and a control unit, whereby the heater unit initially heats the coolant within the independent chamber to a minimum operating temperature prior to operation of the electronic components.

Abstract: A spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The spray cooling system for extreme environments includes an enclosure that isolates the electronic components from the external environment, a spray unit within the enclosure for thermally managing one or more electronic devices, a pump unit fluidly connected to the spray unit, a heat exchanger unit fluidly connected to the pump, and a control valve fluidly connected between the heat exchanger unit and the pump. An independent chamber preferably houses a heater unit, a first power supply and a control unit, whereby the heater unit initially heats the coolant within the independent chamber to a minimum operating temperature prior to operation of the electronic components.