Abstract: An applicator package may include a pouch formed from one or more pliable membranes, the pouch comprising a first compartment and a second compartment, the first compartment being separated from the second chamber by a sealing juncture, a material sealed within the first compartment and an applicator having an applicator end in a handle end sealed within the second compartment. The membrane is formed from a material and has a thickness so as to allow the membrane to be manually punctured by the applicator end of the applicator for insertion of the applicator end into contact with the material in the first compartment.

Abstract: The present invention provides a device for injection of formulations into a patient. In one embodiment the injection is sub-cutaneous. The device is convenient for injecting viscous formulations that would otherwise clog conventional injection devices, for example formulations containing microspheres, suspensions, and other viscous substances. Generally, the device features a needle for piercing the skin, an internal chamber for holding and transmitting fluid, a plunger for applying pressure to the internal chamber, a switch for triggering withdrawal of the needle, a sheath at least partially encompassing the needle and having a flow path within the sheath, and a spring that expands when the switch is triggered, and which thereby at least partially withdraws the needle from the sheath.

Abstract: The present invention provides a device for injection of formulations into a patient. In one embodiment the injection is sub-cutaneous. The device is convenient for injecting viscous formulations that would otherwise clog conventional injection devices, for example formulations containing microspheres, suspensions, and other viscous substances. Generally, the device features a needle for piercing the skin, an internal chamber for holding and transmitting fluid, a plunger for applying pressure to the internal chamber, a switch for triggering withdrawal of the needle, a sheath at least partially encompassing the needle and having a flow path within the sheath, and a spring that expands when the switch is triggered, and which thereby at least partially withdraws the needle from the sheath.

Abstract: Apparatus for aspirating and dispensing liquid samples in an analytical instrument, e.g., a hematology instrument, includes a liquid-sampling valve that, while operating to segment and position for dispensing one or more precise volumes of a liquid sample that has been aspirated into the valve by a pump, simultaneously enables the apparatus to be operated in an aspirate/dispense (suck-and-spit) mode in which a liquid sample can be selectively driven through the valve in opposite directions by a pump, e.g., a syringe pump.

Abstract: Apparatus for aspirating and dispensing liquid samples in an analytical instrument, e.g., a hematology instrument, includes a liquid-sampling valve that, while operating to segment and position for dispensing one or more precise volumes of a liquid sample that has been aspirated into the valve by a pump, simultaneously enables the apparatus to be operated in an aspirate/dispense (suck-and-spit) mode in which a liquid sample can be selectively driven through the valve in opposite directions by a pump, e.g., a syringe pump.

Abstract: An integrated circuit characterization printed circuit board and method is provided for improving the uniformity of impedance introduced by a test fixture across all of the pins of the integrated circuit device. The printed circuit board includes an array of substantially similar test contacts numbering greater than the pins of the integrated circuit device. The array of test contacts includes an active portion configured for electrically coupling with the corresponding pins on the integrated circuit device and an inactive portion adjacent to the active portion and electrically coupled to a reference signal on the printed circuit board.

Abstract: A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relationship such that each contact pad of the first component locationally corresponds to one of the contact pads of the second component. The contact pads of the second component are further arranged such that at least two of the contact pads are laterally offset relative to their locationally corresponding contact pads on the first component with one of the at least two contact pads being offset in a first direction while the other is offset in another direction. A mass of conductive material is disposed between each contact pad of the first component and its corresponding contact pad of the second component.

Abstract: An integrated circuit characterization printed circuit board and method are provided for improving the uniformity of impedance introduced by a test fixture across all of the pins of an integrated circuit device. The printed circuit board includes an array of substantially similar test contacts numbering greater than the pins of the integrated circuit device. The array of test contacts includes an active portion configured for electrically coupling with the corresponding pins on the integrated circuit device and an inactive portion adjacent to the active portion and electrically coupled to a reference signal on the printed circuit board.

Abstract: A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relationship such that each contact pad of the first component locationally corresponds to one of the contact pads of the second component. The contact pads of the second component are further arranged such that at least two of the contact pads are laterally offset relative to their locationally corresponding contact pads on the first component with one of the at least two contact pads being offset in a first direction while the other is offset in another direction. A mass of conductive material is disposed between each contact pad of the first component and its corresponding contact pad of the second component.

Abstract: An integrated circuit characterization printed circuit board and method are provided for improving the uniformity of impedance introduced by a test fixture across all of the pins of an integrated circuit device. The printed circuit board includes an array of substantially similar test contacts numbering greater than the pins of the integrated circuit device. The array of test contacts includes an active portion configured for electrically coupling with the corresponding pins on the integrated circuit device and an inactive portion adjacent to the active portion and electrically coupled to a reference signal on the printed circuit board.

Abstract: An integrated circuit characterization printed circuit board and method is provided for improving the uniformity of impedance introduced by a test fixture across all of the pins of the integrated circuit device. The printed circuit board includes an array of substantially similar test contacts numbering greater than the pins of the integrated circuit device. The array of test contacts includes an active portion configured for electrically coupling with the corresponding pins on the integrated circuit device and an inactive portion adjacent to the active portion and electrically coupled to a reference signal on the printed circuit board.

Abstract: A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relationship such that each contact pad of the first component locationally corresponds to one of the contact pads of the second component. The contact pads of the second component are further arranged such that at least two of the contact pads are laterally offset relative to their locationally corresponding contact pads on the first component with one of the at least two contact pads being offset in a first direction while the other is offset in another direction. A mass of conductive material is disposed between each contact pad of the first component and its corresponding contact pad of the second component.

Abstract: A brush seal includes a retainer and a multiplicity of single bristles each bristle having a fixed end and a free sealing end, the fixed ends being individually attached in a continuous arrangement at the same angle to the retainer, the bristles having a uniform pack density throughout the extent of the bristles from the fixed to the sealing end.

Abstract: An interconnect device for connecting an electronic package, whether it be a single chip or a multi-component device, to a primary substrate requiring the mating of dissimilar solder patterns includes a secondary substrate having a first face and a second face. The first face of the secondary substrate may include a first pattern of conductive lands formed on the first face corresponding to a plurality of conductive leads of an electronic package. The second face of the secondary substrate includes a second pattern of conductive lands corresponding to a plurality of conductive lands formed on the primary substrate. The first pattern of conductive lands formed on the first face is electrically connected to the second pattern of conductive lands formed on the second face via surface and internal conductive paths. Solder ball reflow soldering methods are used to connect the electronic device to the secondary substrate and to connect the secondary substrate to the primary substrate.

Abstract: A device and method for high volume solder sphere alignment and placement including the high volume solder sphere alignment and placement for BGA and CSP packages including a pre-form stencil having a pattern of apertures formed through its cross-section, that corresponds to the pattern of the exposed conductive lands of a circuit requiring sphere alignment and placement. The apertures may be formed having diameters that are approximately 5% larger in diameter than the solder spheres. The method for high volume solder sphere alignment and placement may include the steps of prepping the workpiece, applying a thin layer of flux to the conductive lands. Aligning the pre-form stencil with the part to which the solder balls are to be aligned with and placed upon. Applying the solder spheres through the pattern of apertures onto the conductive lands.

Abstract: A method for cleaning and coating a conductor in a plasma reaction chamber utilizing a plasma gas mixture containing Argon and CF.sub.4 to clean and coat a conductor. The method for cleaning and coating a conductor includes the combination of cleaning processes including, physical reduction and chemical reaction and the formation of a polymerization passivation film formed on oxyfluoro metal compositions (SnO.sub.x F.sub.y) which occur during exposure of a conductor to the process of the invention. The polymerization passivation film is formed as a result of the combination of the degraded carbon Tetrafloride (CF.sub.4) gas and degraded environmental and casual hydrocarbons which are present in the form of a variety of unspecified organic contaminants to form crude polymeric molecules in the high energy environment of the plasma.

Abstract: A cigarette includes a longitudinally segmented combustible fuel element, and a substrate carrying tobacco extract and glycerin positioned physically separate from the fuel element. The fuel element is composed of a carbonaceous material and is extruded in such a manner that when positioned within the cigarette, its extrusion axis is perpendicular to the longitudinal axis of the cigarette. The fuel element includes a burning segment at one end, a base segment at the opposite end, and an isolation segment between the burning and base segments. A metal cartridge is radially spaced from the longitudinal outer periphery of the burning segment of the fuel element. A retaining member grasps the base segment of the fuel element and holds the fuel element securely in place within the cigarette.

Abstract: An aerosol delivery article includes a longitudinally segmented combustible fuel element, and a substrate carrying flavor or a drug positioned physically separate from the fuel element. The fuel element is composed of a carbonaceous material and is extruded in such a manner that when positioned within the article, its extrusion axis is perpendicular to the longitudinal axis of the article. The fuel element is segmented longitudinally and includes a burning segment at one end, a base segment at the opposite end, and an isolation segment between the burning and base segments. A metal cartridge is radially spaced from the longitudinal outer periphery of the burning segment of the fuel element. A retaining member grasps the base segment of the fuel element and holds the fuel element securely in place within the article.

Abstract: A cigarette includes a longitudinally segmented combustible fuel element, and a substrate carrying tobacco extract and glycerin positioned physically separate from the fuel element. The fuel element is composed of a carbonaceous material and is extruded in such a manner that when positioned within the cigarette, its extrusion axis is perpendicular to the longitudinal axis of the cigarette. The fuel element includes a burning segment at one end, a base segment at the opposite end, and an isolation segment between the burning and base segments. A metal cartridge is radially spaced from the longitudinal outer periphery of the burning segment of the fuel element. A retaining member grasps the base segment of the fuel element and holds the fuel element securely in place within the cigarette.