Abstract: A semiconductor-on-insulator die can include a power amplifier configured to amplify a radio frequency input signal having a fundamental frequency. The die can further include an output matching circuit including first and second second-order harmonic rejection circuits configured to resonate at about two times the fundamental frequency and a third order harmonic rejection circuit configured to resonate at about three times the fundamental frequency.

Abstract: Circuits, devices and methods related to impedance tuners. In some embodiments, a capless impedance tuner can include first node and second nodes, a first series path, a second series path, and an inductance path, each between the first node and the second node and including a switch to allow the path to couple or uncouple the first and second nodes. Each series path can be configured to allow a substantially continuous flow of a direct current between the first node and the second node when coupled. The tuner can further include a shunt path with a switch to allow coupling or uncoupling of the second node and ground. The tuner can further include a switchable grounding path implemented along the inductance path and configured to allow the inductance path to function as a series inductance path between the first and second nodes, or as a shunt inductance path between the ground and a node along the inductance path.

Abstract: Integrated Doherty power amplifiers are provided herein. In certain implementations, a Doherty power amplifier includes a carrier amplification stage that generates a carrier signal, a peaking amplification stage that generates a peaking signal, and an antenna structure that combines the carrier signal and the peaking signal. The antenna structure radiates a transmit wave in which the carrier signal and the peaking signal are combined with a phase shift.

Abstract: A combiner circuit can be implemented as a coupling circuit having a common node and configured to couple the common node to one of first and second groups of filters through a first path and to couple the common node to the other group through a second path. The coupling circuit can be further configured such that the impedance provided by each filter of the one of the first and second groups for a signal in each band of the other group results in the signal being sufficiently excluded from the first path.

Abstract: In some embodiments, an architecture can include a first group of filters each configured to support a band such that a first frequency range covers the respective bands, and a second group of one or more filters each configured to support a band such that a second frequency range covers the respective one or more bands. Each filter of the first group can be configured to provide an impedance at or near a short circuit impedance for a signal in each band of the second group, and each filter of the second group can be configured to provide an impedance at or near a short circuit impedance for a signal in each band of the first group. The filters of the first and second groups can be implemented as one or more multiplexers. The architecture can further include a coupling circuit having a common node and configured to couple the common node to the one or more multiplexers through a first path and a second path.

Abstract: Bride combiners with resonators for radio-frequency applications. A bridge combiner can be implemented as a coupling circuit that includes a common node and configured to couple the common node to a first group of filters through a first path and to couple the common node to a second group of one or more filters through a second path. The coupling circuit can include a resonator such that an impedance provided by each filter of the first group for a signal in each band of the second group results in the signal being sufficiently excluded from the first path, and such that an impedance provided by each filter of the second group for a signal in each band of the first group results in the signal being sufficiently excluded from the second path.

Abstract: Phase shifters for communication systems are provided herein. In certain embodiments, a phase shifter includes a plurality of phase shifting sections and a plurality of selection switches each coupled to a corresponding one of the phase shifting sections. The selection switches are formed on a semiconductor die, and are operable to connect one or more selected phase shifting sections between an input terminal and an output terminal, thereby controlling an overall phase shift provided by the phase shifter.

Abstract: A semiconductor-on-insulator die can include a power amplifier configured to amplify a radio frequency input signal having a fundamental frequency. The die can further include an output matching circuit including first and second second-order harmonic rejection circuits configured to resonate at about two times the fundamental frequency and a third order harmonic rejection circuit configured to resonate at about three times the fundamental frequency.

Abstract: Integrated Doherty power amplifiers are provided herein. In certain implementations, a Doherty power amplifier includes a carrier amplification stage that generates a carrier signal, a peaking amplification stage that generates a peaking signal, and an antenna structure that combines the carrier signal and the peaking signal. The antenna structure radiates a transmit wave in which the carrier signal and the peaking signal are combined with a phase shift.

Abstract: In some embodiments, a method for multiplexing signals can include providing multiple subcarriers, selecting a group of one or more subcarriers among the multiple subcarriers, and adjusting each subcarrier of the selected group. The method can further include performing a multiplexing operation with the multiple subcarriers to obtain an output signal, with the output signal having an adjusted property resulting from the adjusting of the one or more subcarriers of the selected group. In some embodiments, the multiple subcarriers can include one or more groups of data subcarriers and one or more groups of guard band subcarriers.

Abstract: An antenna architecture can include a common node and a plurality of signal paths each having first and second ends, with the first end coupled to the common node, such that a common signal provided at the common node splits into respective signals in the signal paths. The antenna architecture can further include a phase shifter block implemented along each of at least some of the signal paths, with the phase shifter block including a phase shifting line to provide a phase shift for the signal passing through the respective signal path, such that the signals emerging from the signal paths are provided with incremental phase shifts. The antenna architecture can further include an antenna unit coupled to the second end of each signal path, such that the signals provided to the antenna units result in a transmitted signal being directed at a tilt angle with respect to the antenna units.

Abstract: A half-bride combiner can be implemented as a coupling circuit having a common node and configured to couple the common node to one of first and second groups of filters through a first path and to couple the common node to the other group through a second path. The coupling circuit can be further configured such that the impedance provided by each filter of the one of the first and second groups for a signal in each band of the other group results in the signal being sufficiently excluded from the first path.

Abstract: Antenna systems with millimeter wave diplexing using antenna feeds are provided. In certain embodiments, a mobile device includes a front-end system including a first radio frequency circuit configured to output a first radio frequency signal of a first carrier frequency, and a second radio frequency circuit configured to output a second radio frequency signal of a second carrier frequency. The mobile device further includes a patch antenna including a first signal feed configured to receive the first radio frequency and a second signal feed configured to receive the second signal feed, the first signal feed providing a high impedance at the second carrier frequency and the second signal feed providing a high impedance at the first carrier frequency.

Abstract: An impedance tuning circuit includes a first node and a second node, and an inductance circuit including an inductor and a first switch connected in series such that the inductor is connected to the first node and the first switch is connected to the second node. The inductance circuit further includes a second switch implemented between ground and a third node between the inductor and the first switch, such that the inductance circuit is capable of providing a series inductance path between the first and second nodes or a shunt inductance path between the third node and the ground.

Abstract: A bridge combiner can be implemented as a coupling circuit that includes a common node and configured to couple the common node to a first group of filters through a first path and to couple the common node to a second group of one or more filters through a second path. The coupling circuit can include a resonator such that an impedance provided by each filter of the first group for a signal in each band of the second group results in the signal being sufficiently excluded from the first path, and such that an impedance provided by each filter of the second group for a signal in each band of the first group results in the signal being sufficiently excluded from the second path.

Abstract: An architecture can include a first group of filters each configured to support a band such that a first frequency range covers the respective bands, and a second group of one or more filters each configured to support a band such that a second frequency range covers the respective one or more bands. Each filter of the first group can be configured to provide an impedance at or near a short circuit impedance for a signal in each band of the second group, and each filter of the second group can be configured to provide an impedance at or near a short circuit impedance for a signal in each band of the first group. The filters of the first and second groups can be implemented as one or more multiplexers. The architecture can further include a coupling circuit having a common node and configured to couple the common node to the one or more multiplexers through a first path and a second path.

Abstract: Apparatus and methods for beamforming communication systems with power control based on antenna pattern configuration are provided. In certain embodiments, a beamforming communication system includes an antenna array including a plurality of antenna elements. The beamforming communication system further includes a plurality of signal conditioning circuits operatively associated with the antenna elements, and an antenna array management circuit that generates a plurality of control signals that individually control the signal conditioning circuits. The antenna array management circuit achieves a desired level of power control based on generating the control signals to select an antenna pattern configuration associated with a desired power control level.

Abstract: Circuits, devices and methods related to impedance tuners. In some embodiments, a capless impedance tuner can include first node and second nodes, a first series path, a second series path, and an inductance path, each between the first node and the second node and including a switch to allow the path to couple or uncouple the first and second nodes. Each series path can be configured to allow a substantially continuous flow of a direct current between the first node and the second node when coupled. The tuner can further include a shunt path with a switch to allow coupling or uncoupling of the second node and ground. The tuner can further include a switchable grounding path implemented along the inductance path and configured to allow the inductance path to function as a series inductance path between the first and second nodes, or as a shunt inductance path between the ground and a node along the inductance path.

Abstract: Apparatus and methods for distributing millimeter wave cellular service over a face of a building are disclosed. In certain embodiments, an antenna assembly includes an antenna upper unit configured to extend from a top of a building, such as from a roof. The antenna upper unit includes a first linear antenna array that radiates a transmit beam having a disc-shaped pattern. The antenna assembly includes an antenna lower unit configured to extend from the building beneath the antenna upper unit. The antenna lower unit includes a second linear antenna array that receives the transmit beam.

Abstract: Power amplifier systems with DC current reuse across stages are disclosed. In certain embodiments, a mobile device includes a transceiver configured to generate a first radio frequency input signal, and a front end system. The front end system includes a first power amplifier stage configured to amplify the first radio frequency input signal to generate a first radio frequency output signal, and a second power amplifier stage configured to amplify a second radio frequency input signal to generate a second radio frequency output signal. The first power amplifier stage and the second power amplifier stage are electrically connected in a first stack between a first power high supply voltage and a power low supply voltage and configured to operate with a shared DC bias current.