Abstract: A component module (15, 70), adapted for piggyback mounting on an IC Dip (51,81), preferably incorporates a decoupling capacitor (18, 44, 74), with opposite end electrodes (23, 24), encapsulated within a molded housing (21, 72) of preferably parallelepiped configuration. The electrodes are uniquely connected to only two of preferably four rectangularly shaped terminals (26-29, 76-79) that project downwardly from different corners of the housing. The terminals, as well as an optional heat sink (61) are preferably formed out of a strip stock carrier (33). The two capacitor-connected terminals (27, 29 and 77, 79) are uniquely diagonally disposed and spaced, for a decoupling application, so as to respectively engage the battery and ground leads of a standard pin-out DIP (51, 81). The other two diagonally disposed component module terminals (26, 28 or 76, 78) are electrically isolated from the capacitor, being employed only to facilitate the mounting of the module on an associated DIP.

Abstract: A thru-hole insertable terminal (10, 50, 60) includes an upper shank portion (12, 52, 66) preferably adapted for soldered securement to an end electrode (24) of a component (20), such as a capacitor. A lower shank portion (14, 54, 68) is dimensioned and adapted for minimal initial contact insertion into, and the temporary securement thereafter within, an oversized thru-hole (26, 58, 62) of a supporting substrate, such as a circuit board (28, 59, 64). At least one upwardly extending free-ended tab (32, 56, 72, 74) is formed in the lower terminal shank portion (14, 54, 68), and is oriented in the major plane thereof until after the insertion thereof within an associated substrate-formed thru-hole (26, 58, 62). Stop means (14b, 14c, 54b, 54c, 68b, 68c) also formed in the lower terminal shank portion is adapted to position the upper free end of the tab at an elevation preferably below the upper open end of a confining thru-hole.

Abstract: A component module (15, 70), adapted for piggyback mounting on an IC Dip (51,81), preferably incorporates a decoupling capacitor (18, 44, 74), with opposite end electrodes (23, 24), encapsulated within a molded housing (21, 72) of preferably parallelepiped configuration. The electrodes are uniquely connected to only two of preferably four rectangularly shaped terminals (26-29, 76-79) that project downwardly from different corners of the housing. The terminals, as well as an optional heat sink (61) are preferably formed out of a strip stock carrier (33). The two capacitor-connected terminals (27, 29 and 77, 79) are uniquely diagonally disposed and spaced, for a decoupling application, so as to respectively engage the battery and ground leads of a standard pin-out DIP (51, 81). The other two diagonally disposed component module terminals (26, 28 or 76, 78) are electrically isolated from the capacitor, being employed only to facilitate the mounting of the module on an associated DIP.

Abstract: A fixture (31) is constructed of plastic for holding a stack of electrical components (10) that are to be sequentially picked off (77) from the bottom of the stack and fed to a component insertion machine. The fixture includes a receiver (32) having a passageway (47) into which projects shoulder(s) 68 for supporting a tube (14) of components. The components are held in the tube, during loading and unloading by a stylus-like tool (30) which fits within a tube slot (26). The tool is used to support and guide the components during movement of the components through the receiver passageway onto or from a removable support tab (57) without spillage or jamming of the components in the passageway.

Abstract: Plate-like carriers (51) having box-receiving slots (54) formed along one edge and rack teeth (58) formed along an opposite edge are fed from a stack (52) and along a trackway (53) where a pair of cog devices (59 and 61) are cyclically operated on fast and slow cycles to engage the rack teeth and move the carriers along the trackway. Boxes (30) are fed into each advanced carrier slot, whereafter the boxes are moved to an encapsulant dispensing station (63). During each slow cycle of operation of the cog devices a metered charge of encapsulant is dispensed into each pair of adjacent boxes. At a subsequent station (67) a strip (68) of lead-attached capacitors (36) are loaded into all the boxes in a carrier. The assembled boxes and capacitors are stripped from the carrier and moved through an encapsulant curing oven (80).

Abstract: A strip (21) of pairs of terminals (13 and 14) are incrementally advanced into a bonding station (24) where electrical components, e.g., metallized film capacitors (10), are successively advanced adjacent to each pair of terminals. Each pair of terminals is bent into engagement with a pair of heat fusible end electrodes (11 and 12) on each electrical component. Sets of three welding pulses are respectively applied by a pair of welding devices (36 and 37) to each terminal. The welding pulses are monitored and if found to be below a predetermined magnitude, additional sets of welding pulses are applied to the electrodes. If a programmed control system ascertains that three successive welding attempts are unsatisfactory, or if five welding attempts are unsatisfactory in nine cycles of operation of the overall apparatus, further cyclic operation of the apparatus is interrupted. Facilities (38, 39 and 40) are provided to upset and reshape any metallic flash resulting from the welding operations.

Abstract: A strip (11) of pairs of orthogonally projecting fragile terminals (14 and 16) with components (10) bonded therebetween is wound in a trackway (58) formed by a helical fin (57) extending from a cylinder (51). The cylinder (51) is mounted on a drum (52) that is intermittently driven by a constantly energized motor (36). Facilities (59) are provided to permit axial loading of the cylinder on the drum. A drive pin (67) arrangement provides a positive drive from the drum to the cylinder. The height of the helical fin is designed to be higher than the height of the strip of terminated components so that the confined strip of components may be transported without danger of damage.

Abstract: A pair of very thin dielectric films, each completely metallized on one side, are positively advanced over a pair of drums of a machine while the films are laser scribed and slit to form two sets of film strips each of which has a laser scribed capacitor plate formed thereon. The film strips forcibly emanating from the drums pass through a number of tension responsive devices and are wound on one of a pair of successively positioned takeup split mandrels. A compensating mechanism is included in one of the drum drives to vary the speed of the drums to compensate for the difference in diameters of the wound convolutions of one set of film strips with respect to the other set so that a succession of capacitor blanks are snugly wound with consistent geometric size and capacitance value.

Abstract: A rolled metallized film capacitor is manufactured by completely metallized one surface of each of a pair of dielectric films, and advancing the films while laser scribing patterns of demetallized lines on the respective films which are wound together to provide a pair of capacitor plates of finite areas. As the films are advanced the laser scribing is controlled so that when the films are wound together, the lines on the respective films are in overlaying relationship on the core and peripheral windings, and are diverted to opposed marginal edge portions of the respective films on the intervening windings. When the rolled capacitor films are terminated and connected to a power source the opposed metallized areas on the core and peripheral windings are subjected to equal potentials, whereas the remainder of the windings present two metallized areas between the opposed margin lines which are subjected to potential of opposite polarity to accumulate charges and function as capacitor plates.

Abstract: A pair of very thin dielectric films, each completely metallized on one side, are positively advanced over a pair of drums of a machine while the films are laser scribed and slit to form two sets of film strips each of which has a laser scribed capacitor plate formed thereon. The film strips forcibly emanating from the drums pass through a number of tension responsive devices and are wound on one of a pair of successively positioned takeup split mandrels. A compensating mechanism is included in one of the drum drives to vary the speed of the drums to compensate for the difference in diameters of the wound convolutions of one set of film strips with respect to the other set so that a succession of capacitor blanks are snugly wound with consistent geometric size and capacitance value.