Abstract: A method of pre-forming a length of fine wire while simultaneously making a fire wire interconnection between a first and a second bonding point on a semiconductor device includes the steps of teaching the location of the edges of the die and teaching a plane in space which is located away from the edges of said die. After teaching the height of the clearance above the die and the XYZ location of the first and second bonding points the automatic wire bonder in directed to generate a desired geometric link profile between bonding points which defines the length of links L1, L2 and L3. Using the geometric profile and empirically determined constants the automatic wire bonder calculates a tool trajectory for pre-forming the fine wire while simultaneously making a fine wire interconnection with an automatic wire bonder.

Abstract: A method for increasing accuracy and reducing the time required to teach the target bonding points on a reference semiconductor device and its associated lead frame comprises manually approximately locating at least a first target bonding point and at each approximately located bonding point causing the pattern recognition system (PRS) of an automatic wire bonder to relocate the exact center of preferred target bonding point automatically. The direction and approximate distance to the next point is programmed into the PRS to enable the PRS to automatically step to the next approximate location of a next bonding point or a pad or a lead. At each pad or lead the PRS is programmed to find or relocate this bonding point at the exact center or preferred target bonding point on the lead or pad.

Abstract: A novel method of making very low profile fine wire interconnections is accomplished with a conventional automatic gold wire ball bonder and includes the steps of making a conventional first ball bond and moving the bonding tool so as to pay out a length of wire that is shorter than the final desired length of wire to be used in the interconnection. The bonding tool is movingly engaged against the target on which the second bond is to be made employing a first bonding force which bends and conforms the wire beneath the working face of the capillary bonding tool and simultaneously forward extrudes and wire draws the neck of the fine wire into a tapered section which avoids backward extrusion. Subsequently a second bond force and ultrasonic energy is applied at the second bond target position to generate a conventional thermosonic second bond.

Abstract: Apparatus and a method of correcting for repeatable positioning errors in an X-Y table is provided. An accurate mask is provided having a plurality of repetitive recognizable patterns thereon which is placed in the field of view of a pattern recognition system of a semiconductor processing machine to be calibrated. The semiconductor processing machine is programmed to perform a series of steps which steps the X-Y table to positions which are supposedly accurate relative to a fixed point. At each of the stepped points, the plurality of repetitive recognizable patterns on the mask are electronically scanned by the pattern recognition system and the deviation of the position of the pattern relative to the desired position is calculated to provide X and Y deviations from the theoretical position of the X-Y table.