Abstract: An electrical jack module comprising a vertically stacked series of electrical jacks having respective housings provided with respective open-ended axial bores wherein an electrical jack plug may be inserted for interference engagement with a protruding portion of a moveable contact member biased resiliently into electrical engagement with a fixed contact member disposed in grooves in the longitudinal side surfaces of the housings. A pair of the fixed contact members comprise integral end portions of a pre-shaped shunt wire press-fitted into plurality of communicating grooves provided in aligned side surfaces of adjacent housings in the vertically stacked series. The moveable contact members are integrally connected through respective preshaped spring wires disposed in grooves in the sides surfaces of the housing to respective wire terminals protruding in a common array from a proximal supporting surface of the vertically stacked series of housings.

Abstract: A jackfield assembly comprising a linear array of electrical jack modules disposed along a longitudinal marginal portion of a printed circuit having a conforming array of apertured areas, each of which includes a predetermined pattern of through-apertures disposed for receiving therein respective wire terminals protruding from a proximal supporting surface of a respective one of the modules for electrical connection to a printed circuit conductor provided on the board. Also, each of the apertured areas includes a through-hole suitably located for receiving a snug-fitting post also extending from the proximal supporting surface of a respective one of the module. Each of the modules has a distal surface provided with a plurality of protruding stubs over which are press-fitted respective through-holes in a rigid interlocking strip which prevents rotational or racking movement of one of the modules relative to the other modules in the array.