Abstract: A method of characterizing an electromigration (EM) parameter for use in an integrated circuit (IC) chip design including, inputting a layout of a wire layer and identifying a signal gate-circuit including electrically parallel paths, connected to an output of the signal gate from the layout. Based on widths for each of the paths, determining a maximum possible current for each of the paths, and calculating an average current for each of the paths. Identifying a path that is most limited in its current carrying capacity by possible EM failure mechanisms, and storing in a design library, a possible maximum current output to the identified limiting path, as the EM parameter.

Abstract: A method of characterizing an electromigration (EM) parameter for use in an integrated circuit (IC) chip design including, inputting a layout of a wire layer and identifying a signal gate-circuit including electrically parallel paths, connected to an output of the signal gate from the layout. Based on widths for each of the paths, determining a maximum possible current for each of the paths, and calculating an average current for each of the paths. Identifying a path that is most limited in its current carrying capacity by possible EM failure mechanisms, and storing in a design library, a possible maximum current output to the identified limiting path, as the EM parameter.

Abstract: A method of estimating an inductance delay includes determining a resistance-capacitance (RC) delay with resistances and capacitances of a network and estimating an inductance delay of the network by determining a propagation delay of an electromagnetic (EM) field across wires of the network. Additionally, the method includes determining if the RC delay is below a specified threshold and adding the estimated inductance delay to the RC delay to determine a total time to propagate voltage swings through the network if the RC delay is below the specified threshold.

Abstract: Methods of treating via obstructions during design rule checking. The method comprises examining the size of the via obstruction with respect to a minimum size and a minimum spacing constraint of a design rule. Based upon the comparison, a neighboring via count for a number of via shapes neighboring the via obstruction may be initialized to equal a positive integer. Based upon the comparison, the via obstruction may be represented with a plurality of smaller via shapes during design rule checking.

Abstract: Forming of a statistical model for a set of independently variable parameters for analysis of a circuit design is disclosed. In one embodiment, a method includes establishing a timing model including delay and delay changes due to process parameter variations (Pi) that impact timing; selecting an element of the circuit design that dominates circuit delay in the timing model; determining a delay sensitivity of each of a set of derived process parameters (Vj) for the element that are linear combinations of the process parameter variations (Pi); and selecting only those derived process parameters with a high sensitivity for use in the statistical model. The invention simplifies the statistical model and reduces the number of calculations require for timing analysis. A method of performing a timing analysis using the simplified statistical model is also disclosed.

Abstract: A method of estimating an inductance delay includes determining a resistance-capacitance (RC) delay with resistances and capacitances of a network and estimating an inductance delay of the network by determining a propagation delay of an electromagnetic (EM) field across wires of the network. Additionally, the method includes determining if the RC delay is below a specified threshold and adding the estimated inductance delay to the RC delay to determine a total time to propagate voltage swings through the network if the RC delay is below the specified threshold.

Abstract: Methods of treating via obstructions during design rule checking. The method comprises examining the size of the via obstruction with respect to a minimum size and a minimum spacing constraint of a design rule. Based upon the comparison, a neighboring via count for a number of via shapes neighboring the via obstruction may be initialized to equal a positive integer. Based upon the comparison, the via obstruction may be represented with a plurality of smaller via shapes during design rule checking.

Abstract: Disclosed are embodiments of an interconnection array for a circuit. The interconnection array comprises a victim net that is positioned parallel to and adjacent to sections of multiple crossed aggressor nets, thereby, minimizing the exposure of the circuit to delay or false switching as a result of coupling capacitance. Also, disclosed are embodiments of an associated method of re-routing an interconnection array that incorporates identifying a victim net and at least two aggressor nets and crossing the aggressor nets so that sections of multiple aggressor nets are positioned parallel to and adjacent to the victim net in order to minimizes the impact of coupling capacitance on the victim net with minimal changes to the wiring environment.

Abstract: A integrated circuit (IC) chip with ESD robustness and the system and method of wiring the IC chip. Minimum wire width and maximum resistance constraints are applied to each of the chip's I/O ports. These constraints are propagated to the design. Array pads are wired to I/O cells located on the chip. Unused or floating pads may be tied to a power supply or ground line, either directly or through an electrostatic discharge (ESD) protect device. A multi-supply protect device (ESDxx) coupled between pairs of supplies and ground or to return lines is also included. Thus, wiring is such that wires and vias to ESD protect devices are wide enough to provide adequate ESD protection. Robust ESD protection is afforded all chip pads. The design may then be verified.