Patents by Inventor William J. Lypen

William J. Lypen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Planar packageless semiconductor structure with via and coplanar contacts
    Patent number: 7977799
    Abstract: A semiconductor device includes a substrate having a first side and a second side and an epitaxial layer disposed over the second side. The device also includes a conductive via extending through the epitaxial layer to the second side and comprising a conductive contact; and a bond pad disposed over the epitaxial layer and comprising a conductive material, wherein the semiconductor is not provided in a package.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: July 12, 2011
    Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: William J. Lypen, Rick D. Snyder
  • PLANAR PACKAGELESS SEMICONDUCTOR STRUCTURE WITH VIA AND COPLANAR CONTACTS
    Publication number: 20090273093
    Abstract: A semiconductor device includes a substrate having a first side and a second side and an epitaxial layer disposed over the second side. The device also includes a conductive via extending through the epitaxial layer to the second side and comprising a conductive contact; and a bond pad disposed over the epitaxial layer and comprising a conductive material, wherein the semiconductor is not provided in a package.
    Type: Application
    Filed: April 30, 2008
    Publication date: November 5, 2009
    Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: William J. Lypen, Rick D. Snyder