Patents by Inventor William J. MacKillop

William J. MacKillop has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8337243
    Abstract: The cable assembly may include a plug connector, a cable, and a connector. The plug connector may include a housing and a board assembly. The board assembly may include a printed circuit board. The edge of the printed circuit board may be enclosed with a material. The material may be an overmolded plastic or a coating of a material. In order to reduce the crosstalk in the areas where the cable shield is removed, a shielding assembly may be used. The shielding assembly may provide 360 degrees of shielding for the wire pair at the location where the cable shield is removed. The printed circuit board may have a trace layer, a core layer, and a ground plane layer. The ground plane layer may have a portion which is a solid layer and another portion which is a non-solid layer.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: December 25, 2012
    Assignee: Cinch Connectors, Inc.
    Inventors: Hecham K. Elkhatib, James L. McGrath, David W. Mendenhall, William J. MacKillop, Alan A. Raclawski
  • Patent number: 8298009
    Abstract: The cable assembly may include a plug connector, a cable, and a connector. The plug connector may include a housing and a board assembly. The board assembly may include a printed circuit board. The edge of the printed circuit board may be enclosed with a material. The material may be an overmolded plastic or a coating of a material. In order to reduce the crosstalk in the areas where the cable shield is removed, a shielding assembly may be used. The shielding assembly may provide 360 degrees of shielding for the wire pair at the location where the cable shield is removed. The printed circuit board may have a trace layer, a core layer, and a ground plane layer. The ground plane layer may have a portion which is a solid layer and another portion which is a non-solid layer.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: October 30, 2012
    Assignee: Cinch Connectors, Inc.
    Inventors: Hecham K. Elkhatib, James L. McGrath, David W. Mendenhall, William J. MacKillop, Alan A. Raclawski
  • Patent number: 8011950
    Abstract: The cable assembly may include a plug connector, a cable, and a connector. The plug connector may include a housing and a board assembly. The board assembly may include a printed circuit board. The edge of the printed circuit board may be enclosed with a material. The material may be an overmolded plastic or a coating of a material. In order to reduce the crosstalk in the areas where the cable shield is removed, a shielding assembly may be used. The shielding assembly may provide 360 degrees of shielding for the wire pair at the location where the cable shield is removed. The printed circuit board may have a trace layer, a core layer, and a ground plane layer. The ground plane layer may have a portion which is a solid layer and another portion which is a non-solid layer.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: September 6, 2011
    Assignee: Cinch Connectors, Inc.
    Inventors: James L. McGrath, David W. Mendenhall, Hecham K. Elkhatib, William J. MacKillop, Alan A. Raclawski
  • Publication number: 20110195593
    Abstract: The cable assembly may include a plug connector, a cable, and a connector. The plug connector may include a housing and a board assembly. The board assembly may include a printed circuit board. The edge of the printed circuit board may be enclosed with a material. The material may be an overmolded plastic or a coating of a material. In order to reduce the crosstalk in the areas where the cable shield is removed, a shielding assembly may be used. The shielding assembly may provide 360 degrees of shielding for the wire pair at the location where the cable shield is removed. The printed circuit board may have a trace layer, a core layer, and a ground plane layer. The ground plane layer may have a portion which is a solid layer and another portion which is a non-solid layer.
    Type: Application
    Filed: April 20, 2011
    Publication date: August 11, 2011
    Applicant: Cinch Connectors, Inc.
    Inventors: James L. McGrath, David W. Mendenhall, Hecham K. Elkhatib, William J. MacKillop, Alan A. Raclawski
  • Publication number: 20110195592
    Abstract: The cable assembly may include a plug connector, a cable, and a connector. The plug connector may include a housing and a board assembly. The board assembly may include a printed circuit board. The edge of the printed circuit board may be enclosed with a material. The material may be an overmolded plastic or a coating of a material. In order to reduce the crosstalk in the areas where the cable shield is removed, a shielding assembly may be used. The shielding assembly may provide 360 degrees of shielding for the wire pair at the location where the cable shield is removed. The printed circuit board may have a trace layer, a core layer, and a ground plane layer. The ground plane layer may have a portion which is a solid layer and another portion which is a non-solid layer.
    Type: Application
    Filed: April 19, 2011
    Publication date: August 11, 2011
    Applicant: Cinch Connectors, Inc.
    Inventors: James L. McGrath, David W. Mendenhall, Hecham K. Elkhatib, William J. MacKillop, Alan A. Raclawski
  • Publication number: 20100210142
    Abstract: The cable assembly may include a plug connector, a cable, and a connector. The plug connector may include a housing and a board assembly. The board assembly may include a printed circuit board. The edge of the printed circuit board may be enclosed with a material. The material may be an overmolded plastic or a coating of a material. In order to reduce the crosstalk in the areas where the cable shield is removed, a shielding assembly may be used. The shielding assembly may provide 360 degrees of shielding for the wire pair at the location where the cable shield is removed. The printed circuit board may have a trace layer, a core layer, and a ground plane layer. The ground plane layer may have a portion which is a solid layer and another portion which is a non-solid layer.
    Type: Application
    Filed: February 18, 2009
    Publication date: August 19, 2010
    Applicant: Cinch Connectors, Inc.
    Inventors: James L. McGrath, David W. Mendenhall, Hecham K. Elkhatib, William J. MacKillop, Alan A. Raclawski