Patents by Inventor William J. Palmteer

William J. Palmteer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount package for a high power light emitting diode
    Patent number: 7157744
    Abstract: A package for a light emitting diode (LED) including an electrically insulating substrate layer, a non-conductive layer disposed on the electrically insulating substrate layer, and a reflector layer disposed on the non-conductive layer. The electrically insulating layer includes metallized portions for coupling a light emitting diode thereto.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: January 2, 2007
    Assignee: M/A-COM, Inc.
    Inventors: William J. Palmteer, Thomas Yuan, Richard Koba
  • RF termination device
    Publication number: 20030016092
    Abstract: An improved RF termination and a method of providing the RF termination are disclosed. The RF termination for terminating an open RF signal from an open RF signal source, includes a hollow shell, and an axial resistor inserted within the hollow shell, wherein the axial resistor includes a first lead connectable to the open RF signal source and a second lead being grounded by the hollow shell.
    Type: Application
    Filed: July 20, 2001
    Publication date: January 23, 2003
    Inventors: William J. Palmteer, Robert L. Severance, Ernest H. Hoagland
  • Printed circuit board (PCB)
    Patent number: 6414246
    Abstract: A printed circuit board (PCB) is provided for mounting an electronic package thereon. The PCB includes a center pad centrally located in the PCB, a plurality of input/output (I/O) pins peripherally located in the PCB, and at least one slot formed in the center pad for providing escape areas into which contaminants can escape from solder joints associated with mounting of the electronic package onto the PCB.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: July 2, 2002
    Assignee: Tyco Electronics Corporation
    Inventor: William J. Palmteer