Abstract: A junction device for flat flexible cables (FFCs) includes a device housing, a power contact, a signal contact assembly, and a data contact assembly. The power contact defines an input power FFC connection, an output power FFC connection, and a breakout power FFC connection, with the input, output and breakout FFC connections being electrically interconnected. The signal contact assembly defines an input signal FFC connection, an output signal FFC connection, and a breakout signal FFC connection. The signal contact assembly is adapted to output a signal to the breakout signal FFC connection indicative of a signal received at the input signal FFC connection. The data contact assembly includes an input data FFC connection, an output data FFC connection, and a breakout data FFC connection. The data contact assembly is adapted to output a data signal received at the input FFC connection from the output FFC connection and the breakout FFC connection.

Abstract: The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.

Abstract: The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.

Abstract: The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.

Abstract: A modular tooling package is disclosed for use in an assembly machine having a plurality of actuators for operating a plurality of tools. The tooling package comprises a module block and a plurality of tools carried by the module block. Each of the tools is arranged for relative movement in response to forces imparted by a respective one of the actuators at a respective separable interface. A means for removably mounting the module block to the assembly machine enables the tooling package to be removed from the assembly machine as an integral unit. The tooling package is operatively coupled to and decoupled from the assembly machine at the respective separable interfaces, thereby enabling the plurality of tool actuators to remain in the assembly machine when the tooling package is removed therefrom.