Patents by Inventor William J. RENSCH

William J. RENSCH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for determining adjustable wafer acceptance criteria based on chip characteristics
    Patent number: 8862417
    Abstract: Systems and methods for determining adjustable wafer acceptance criteria based on chip characteristics. The method includes measuring a density of at least one chip. The method further includes computing a difference in density between the density of the at least one chip and a density of at least one kerf structure. The method further includes calculating an offset value to modify a Wafer Acceptance Criteria (WAC) to match the density difference between the at least one chip and the at least one kerf structure. The method further includes applying the offset value to the WAC for a wafer level measurement in order to increase chip yield performance.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: October 14, 2014
    Assignee: International Business Machines Corporation
    Inventors: Albert M. Chu, Eric D. Johnson, William J. Rensch, Manikandan Viswanath
  • SYSTEMS AND METHODS FOR DETERMINING ADJUSTABLE WAFER ACCEPTANCE CRITERIA BASED ON CHIP CHARACTERISTICS
    Publication number: 20120310574
    Abstract: Systems and methods for determining adjustable wafer acceptance criteria based on chip characteristics. The method includes measuring a density of at least one chip. The method further includes computing a difference in density between the density of the at least one chip and a density of at least one kerf structure. The method further includes calculating an offset value to modify a Wafer Acceptance Criteria (WAC) to match the density difference between the at least one chip and the at least one kerf structure. The method further includes applying the offset value to the WAC for a wafer level measurement in order to increase chip yield performance.
    Type: Application
    Filed: June 2, 2011
    Publication date: December 6, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Albert M. CHU, Eric D. JOHNSON, William J. RENSCH, Manikandan Viswanath