Patents by Inventor William J. Scanlon

William J. Scanlon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transducer shield
    Patent number: 6421301
    Abstract: A shield for a sonar transducer secured by a flexible clamping band to the bottom of a trolling motor housing. The shield includes a box-like body sized to receive a transducer. The body further includes an open top for flush positioning against a trolling motor housing and an open bottom through which sonar transmissions from the transducer may pass. The body has a pair of slots adjacent its open top for the passage of a clamping band of a hose clamp.
    Type: Grant
    Filed: January 4, 2001
    Date of Patent: July 16, 2002
    Inventor: William J. Scanlon
  • TRANSDUCER SHIELD
    Publication number: 20020085452
    Abstract: A shield for a sonar transducer secured by a flexible clamping band to the bottom of a trolling motor housing. The shield includes a box-like body sized to receive a transducer. The body further includes an open top for flush positioning against a trolling motor housing and an open bottom through which sonar transmissions from the transducer may pass. The body has a pair of slots adjacent its open top for the passage of a clamping band of a hose clamp.
    Type: Application
    Filed: January 4, 2001
    Publication date: July 4, 2002
    Inventor: William J. Scanlon
  • Gas encapsulated cooling module
    Patent number: 4138692
    Abstract: A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be cooled, said stud being supported by a resilient thermally conductive bellow-like structure, whereby the planar surface of the stud is maintained in intimate thermal contact with the planar surface of the chip.
    Type: Grant
    Filed: September 12, 1977
    Date of Patent: February 6, 1979
    Assignee: International Business Machines Corporation
    Inventors: Robert G. Meeker, William J. Scanlon, Zvi Segal
  • Test fixture for use in a high speed electronic semiconductor chip test system
    Patent number: 3979671
    Abstract: The invention relates to apparatus for the testing of high circuit density devices fabricated by large scale integration techniques. More specifically, the invention is directed to a test fixture used in a test system for determining the merit or electrical integrity of small semiconductor chips, diced from a semiconductor wafer having a large number of chips. Each chip being a high circuit density device, e.g., a small monolithic semiconductor structure having a large number of closely spaced circuits thereon and therein.
    Type: Grant
    Filed: March 6, 1975
    Date of Patent: September 7, 1976
    Assignee: International Business Machines Corporation
    Inventors: Robert G. Meeker, William J. Scanlon, Zvi Segal
  • Transducer shield
    Patent number: D458173
    Type: Grant
    Filed: January 4, 2001
    Date of Patent: June 4, 2002
    Inventor: William J. Scanlon