Abstract: An improved arrangement for attaching a heat sink to a flip chip type die is disclosed. More specifically, the heat sink is attached to the back surface of the flip chip die by a metallic solder material. Such an arrangement provides a good thermal conductivity between the die and the heat sink. In some embodiments, the die is mounted on a grid array type substrate in a flip chip arrangement such that the die contacts are coupled to adjacent I/O pads on the substrate. In another aspect, one or more metallic intermediate die attach layers are deposited over the back surface of the die to form a solderable die surface. The heat sink is then attached to the solderable die surface. This approach works well when the chosen solder does not adhere well to the semiconductor die material. In one preferred implementation the intermediate metallic layers include a barrier layer that is deposited over the back surface of the die and a solderable metallic layer that is deposited over the barrier layer.

Abstract: A system and method for receiving and sending information content in audio form to a wireless communication device on demand. The system can be customized by a wireless communication device user to obtain the desired information content in audio form. The customization of the system reduces the amount of time necessary to obtain the desired information and thus the length of time of the communication is reduced.

Abstract: A chip-on-chip integrated circuit package is disclosed. The device includes a substrate having a plurality of conductive landings disposed on a first surface thereof, a first die that is positioned over a substrate, and a second die that is mounted on the first die. The first die has a plurality of I/O pads that face away from the substrate. The second die includes a first set of contacts that mate with the conductive landings on the substrate and a second set of contacts that mate with the I/O pads on the first die. In a preferred embodiment, the first set of contacts on the second die take the form of a first set of solder bumps, and the second set of contacts on the second die take the form of a second set of solder bumps.

Abstract: A power module for providing power to any one of a plurality of special purpose woodworking tools has a variable speed headstock on a base, and a tool support carriage on the base. The tool support carriage is formed with two pairs of tube-receiving sockets for receiving the support tubes of a special purpose woodworking tool. The sockets are formed at two different levels above the base, such levels corresponding to the difference in spacing of the input shaft connections with respect to the support tubes. The base is mounted for movement toward and away from the headstock, providing alignment of the input shaft with the headstock hub. A variable speed drive in the headstock employs an intermediate three-section pulley of the variator type, and a speed control knob is connected to position the variable speed drive to provide for the selection of speed for any particular tool.

Abstract: An item dispensing system is disclosed wherein in a preferred sheet dispensing embodiment, primary and secondary sets of vacuum cups are mounted to one end of a pick arm which is rotated between a stack of sheets and a dispensing path. Initially, a two-way valve is controlled to pass a vacuum from a vacuum source only to one of the primary and secondary sets of vacuum cups. The selected set of suction cups then attempts to vacuum lift and pass a sheet to and along the dispensing path. The failure of a sensor to sense that sheet in the dispensing path within a preselected period of time indicates that the selected set of vacuum cups may have been unsuccessful in vacuum lifting that sheet from the stack due to a poor vacuum seal between the selected set of vacuum cups and that sheet. Such a failure causes a processor to generate a signal to cause the two way valve to apply the vacuum from the vacuum source only to the other one of the primary and secondary sets of vacuum cups.

Abstract: An attachment device is disclosed for affixture on pliers having a first and second plier jaw. The device includes a single jaw lug to be secured to the jaw of a standard compound acting adjustable vise type of hand pliers. A piece of sheet metal is introduced between the jaw lug of the device and the opposing jaw of the hand pliers and pressure is applied to the hand pliers. An offset shoulder is displaced along the edge of the piece of sheet metal parallel to the original contour of the piece of sheet metal to form an offset shoulder and edge.

Abstract: An athletic hand movement restricting device intended for attachment to the forearm and wrist of a bowler. The intent of the device is to restrict the said bowler's hand from rotating inwardly over on top of the bowling ball into an undesireable release position, and when the said device is secured into position on the said bowler's forearm and wrist, the said device restricts the said bowler's hand from rotating inwardly past a pre-selected position, but will allow a full unrestricted rotation of the said bowler's hand in an outwardly direction. The amount of restriction can be increased by the said bowler, previous to the said bowler's turn to play, through the use of a movable adjustment means. The said bowler's wrist is free to flex in all four planes while the said device is in position and while the said device is in use.