Patents by Inventor William J. Scimeca

William J. Scimeca has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11441855
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: September 13, 2022
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Patent number: 11326843
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: May 10, 2022
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Publication number: 20210389062
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Application
    Filed: August 19, 2021
    Publication date: December 16, 2021
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Publication number: 20210265234
    Abstract: Disclosed herein is a thermal interface material comprising a sheet extending between a first major surface and a second major surface, the sheet comprising a base material; and a filler material embedded in the base material comprising anisotropically oriented thermally conductive elements; wherein the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction; and wherein the base material is substantially free of silicone.
    Type: Application
    Filed: May 10, 2021
    Publication date: August 26, 2021
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Publication number: 20210254910
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Application
    Filed: February 2, 2021
    Publication date: August 19, 2021
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich