Abstract: A heat pipe system, method, and heat sink system to enhance heat transfer from a heat-generating component. The method includes generating heat with the heat-generating component. The method also includes transferring at least a portion of the heat to at least a portion of a volatile fluid within one or more heat pipes. The method further includes modifying, dynamically, an active heat transfer region of the one or more heat pipes, thereby dynamically modulating heat transfer from the heat-generating component through the one or more heat pipes.

Abstract: A heat sink to selectively dissipate heat from a plurality of heat-generating components. The heat sink includes a plurality of heat pipes, and a base plate configured to locate at least one of the plurality of heat pipes proximate each of the plurality of heat-generating components. The heat sink also includes a plurality of sets of fins operable to dissipate heat generated by the heat-generating components, and a plurality of sets of louvers, wherein each of the plurality of sets of louvers is associated with one of the plurality of sets of fins and is operable to open to selectively allow airflow from outside the heat sink to dissipate heat from one of the plurality of sets of fins.

Abstract: Provided is a chocking device, including a frame, a plate, and a stop. The frame has an uppermost surface and a lowermost surface opposite the uppermost surface. The plate has a contact surface and is movable between a first position, wherein a portion of the contact surface is substantially coextensive with the uppermost surface of the frame, and a second position, wherein the portion of the contact surface is between the uppermost and lowermost surface of the frame. The stop is coupled to the frame and arranged in direct contact with the plate. The stop is rotatable such that movement of the plate from the first position to the second position rotates the stop from a first to a second stop position. The plate is movable such that the contact surface is substantially parallel when the plate is in the first and second positions.

Abstract: A server includes a printed circuit board (PCB), an electronic component connected to the PCB, and a chassis connected to the PCB. The chassis includes a first end with a first aperture configured to allow airflow into the server, a second end with a second aperture configured to allow the airflow out of the server after having passed across the electronic component, and a movable bulkhead comprising a first set of louvers, the movable bulkhead being movable between a closed position and an opened position, wherein each of the louvers includes a leading edge contact feature configured to interface with a trailing edge of a respective adjacent louver. In the closed position, the first set of louvers forms a wall in a primary path of the airflow, and, in the opened position, the first set of louvers are oriented in a direction of the primary path of the airflow.

Abstract: Provided is a chocking device, including a frame, a plate, and a stop. The frame has an uppermost surface and a lowermost surface. The plate has a substantially planar contact surface and includes an operating region. The plate is movable between a first position, wherein the contact surface is arranged substantially coextensively with the uppermost surface, and a second position, wherein the contact surface is arranged between the uppermost and lowermost surfaces. The stop is coupled to the frame and has an operating portion arranged in direct contact with the operating region. The stop is rotatable such that movement of the plate from the first position to the second position rotates the stop from a first stop position to a second stop position. The operating region is arranged nearer to the uppermost surface than is the operating portion when the stop is in the first and the second stop positions.

Abstract: Thermal control of a multi-chip module in an operating environment is facilitated by predetermining separate thermal control points for multiple chips of the multi-chip module, with a first chip and a second chip having different predetermined thermal control points, and saving the predetermined thermal control points for reference by a thermal control of the multi-chip module in an operating environment. The thermal control monitors an operating temperature of the first chip, and compares the operating temperature of the first chip to the predetermined thermal control point of that chip. The thermal control further initiates a control action to control temperature of the first chip based on comparing the operating temperature of the first chip to the predetermined thermal control point of the first chip.

Abstract: Methods and structures are provided for implementing selective airflow modification. An airflow control member holder receives and retains an airflow control member having compliance characteristics allowing easy removal and changing of the airflow control member. The airflow control member holder includes retention features to facilitate mounting and removal from the system, such as mounting and removal from a printed circuit board (PCB). The airflow control member holder provides a protective function for a component, such as a depopulated component, a central processing unit (CPU) or other device.

Abstract: Thermal control of a multi-chip module in an operating environment is facilitated by predetermining separate thermal control points for multiple chips of the multi-chip module, with a first chip and a second chip having different predetermined thermal control points, and saving the predetermined thermal control points for reference by a thermal control of the multi-chip module in an operating environment. The thermal control monitors an operating temperature of the first chip, and compares the operating temperature of the first chip to the predetermined thermal control point of that chip. The thermal control further initiates a control action to control temperature of the first chip based on comparing the operating temperature of the first chip to the predetermined thermal control point of the first chip.

Abstract: Methods and structures are provided for implementing electronic enclosure cooling containment for concurrent maintenance actions with a top cover of the electronic enclosure removed. The structure includes a moveable airflow baffle being attached to the associated electronic enclosure. During concurrent maintenance actions, the moveable airflow baffle is moved to an open position over at least a partial length of a replaceable component, without being detached or removed from the associated electronic enclosure. During normal operations, the moveable airflow baffle hangs down over at least a partial length of a replaceable component.

Abstract: A method and a system for non-destructively detecting defects within and/or on plated-through holes are provided. The method includes sealing a plated-through hole on a printed circuit board to detect for possible defects along the sidewall of the plated-through hole. The method further includes applying an airflow through the plated-through hole and measuring the airflow entering the plated-through hole at the gasket to determine the initial airflow calculation. The method also includes measuring the airflow again as it exits the plated-through hole to determine an exit airflow calculation. A determination of the quality of the plated-through hole is made by the method by analyzing the initial airflow calculation and the exit airflow calculation.

Abstract: Provided is a chocking device, including a frame, a plate, and a stop. The frame has an uppermost surface and a lowermost surface opposite the uppermost surface. The plate has a contact surface and is movable between a first position, wherein a portion of the contact surface is substantially coextensive with the uppermost surface of the frame, and a second position, wherein the portion of the contact surface is between the uppermost and lowermost surface of the frame. The stop is coupled to the frame and arranged in direct contact with the plate. The stop is rotatable such that movement of the plate from the first position to the second position rotates the stop from a first to a second stop position. The plate is movable such that the contact surface is substantially parallel when the plate is in the first and second positions.

Abstract: Provided is a chocking device, including a frame, a plate, and a stop. The frame has an uppermost surface and a lowermost surface. The plate has a substantially planar contact surface and includes an operating region. The plate is movable between a first position, wherein the contact surface is arranged substantially coextensively with the uppermost surface, and a second position, wherein the contact surface is arranged between the uppermost and lowermost surfaces. The stop is coupled to the frame and has an operating portion arranged in direct contact with the operating region. The stop is rotatable such that movement of the plate from the first position to the second position rotates the stop from a first stop position to a second stop position. The operating region is arranged nearer to the uppermost surface than is the operating portion when the stop is in the first and the second stop positions.

Abstract: Methods and structures are provided for implementing selective airflow modification. An airflow control member holder receives and retains an airflow control member having compliance characteristics allowing easy removal and changing of the airflow control member. The airflow control member holder includes retention features to facilitate mounting and removal from the system, such as mounting and removal from a printed circuit board (PCB). The airflow control member holder provides a protective function for a component, such as a depopulated component, a central processing unit (CPU) or other device.

Abstract: Methods and structures are provided for implementing electronic enclosure cooling containment for concurrent maintenance actions with a top cover of the electronic enclosure removed. The structure includes a moveable airflow baffle being attached to the associated electronic enclosure. During concurrent maintenance actions, the moveable airflow baffle is moved to an open position over at least a partial length of a replaceable component, without being detached or removed from the associated electronic enclosure. During normal operations, the moveable airflow baffle hangs down over at least a partial length of a replaceable component.

Abstract: Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Abstract: Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Abstract: An electronic system enclosure including cooling units to regulate temperature of electrical components therein. In one embodiment, the electronic system enclosure includes field replaceable units which facilitate concurrent maintenance. In this embodiment, air pressure within the electronic system enclosure is maintained while a field replaceable unit is removed. Also in this embodiment, cooling of the remaining electrical components of the electronic system enclosure is continued during removal of a field replaceable unit.

Abstract: Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: A method and computer processor system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry, such as, a high-performance cell processor complex, and a design structure on which the subject circuit resides are provided. The computer system includes predefined processor circuits including anti-tamper logic. A volume container substantially contains the predefined processor circuits including the anti-tamper logic. A heat spreader is provided with the predefined processor circuits within the volume container. An external heatsink structure is attached to an outside cover above the volume container. The heatsink structure includes a heatsink base and a plurality of parallel fins extending outwardly from the heatsink base. A heat pipe extending through a folded mesh is attached to the heat spreader within the volume container and is attached to the external heatsink base providing an effective heat removal path for the processor circuits.