Abstract: Embodiments of the invention provide a thermal management unit including a housing, at least one fan, a plurality of thermoelectric modules, at least one heat sink assembly coupled to the plurality of thermoelectric modules, and controller providing power to the plurality of thermoelectric modules. The thermal management unit also includes a printed circuit board incorporating the plurality of thermoelectric modules and electrically connecting the plurality of thermoelectric modules to the controller. The printed circuit board separates an ambient side of the thermal management unit and an enclosure side of the thermal management unit.