Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: A solar-cell module. The solar-cell module includes a plurality of solar cells that are electrically coupled together. The solar-cell module further includes an in-laminate-diode assembly electrically coupled with the plurality of solar cells. The in-laminate-diode assembly is configured to prevent power loss. The solar-cell module also includes a protective structure at least partially encapsulating the plurality of solar cells. In addition, the solar-cell module includes a plurality of external-connection mechanisms mounted to a respective plurality of edge regions of the protective structure. An external-connection mechanism of the plurality of external-connection mechanisms is configured to enable collection of current from the plurality of solar cells and to allow interconnection with at least one other external device.

Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: Provided herein are methods of incorporating additives into thin-film solar cell substrates and back contacts. In certain embodiments, sodium is incorporated into a substrate or a back contact of a thin-film photovoltaic stack where it can diffuse into a CIGS or other absorber layer to improve efficiency and/or growth of the layer. The methods involve laser treating the substrate or back contact in the presence of a sodium (or sodium-containing) solid or vapor to thereby incorporate sodium into the surface of the substrate or back contact. In certain embodiments, the surface is simultaneously smoothed.

Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: Provided herein are methods of polishing, cleaning and texturing back contacts of thin-film solar cells. According to various embodiments, the methods involve irradiating sites on the back contact with laser beams to remove contaminants and/or smooth the surface of the back contact. The back contact, e.g., a molybdenum, copper, or niobium thin-film, is smoothed prior to deposition of the absorber and other thin-films of the photovoltaic stack. In certain embodiments, laser polishing of the back contact is used to enhance the diffusion barrier characteristics of the back contact layer, with all or a surface layer of the back contact becoming essentially amorphous. In certain embodiments, the adhesion of the absorber layer is enhanced by the textured back contact and by the presence of the amorphous metal at the deposition surface.

Abstract: Provided herein are methods of polishing and texturing surfaces thin-film photovoltaic cell substrates. The methods involve laser irradiation of a surface having a high frequency roughness in an area of 5-200 microns to form a shallow and rapidly expanding melt pool, followed by rapid cooling of the material surface. The minimization of surface tension causes the surface to re-solidify in a locally smooth surface. the high frequency roughness drops over the surface with a lower frequency bump or texture pattern remaining from the re-solidification.

Abstract: A packaging system for storing and transporting one or more flat panel products, the packaging system comprising a plurality of tines, a method of machine-assisted loading a packaging system comprising a plurality of tines, and a method of storing and transporting one or more flat panel products using a packaging system comprising a plurality of tines with alternating channel depths.

Abstract: A solar-cell module. The solar-cell module includes a plurality of solar cells that are electrically coupled together. The solar-cell module further includes an in-laminate-diode assembly electrically coupled with the plurality of solar cells. The in-laminate-diode assembly is configured to prevent power loss. The solar-cell module also includes a protective structure at least partially encapsulating the plurality of solar cells. In addition, the solar-cell module includes a plurality of external-connection mechanisms mounted to a respective plurality of edge regions of the protective structure. An external-connection mechanism of the plurality of external-connection mechanisms is configured to enable collection of current from the plurality of solar cells and to allow interconnection with at least one other external device.

Abstract: Provided herein are methods of polishing and texturing surfaces thin-film photovoltaic cell substrates. The methods involve laser irradiation of a surface having a high frequency roughness in an area of 5-200 microns to form a shallow and rapidly expanding melt pool, followed by rapid cooling of the material surface. The minimization of surface tension causes the surface to re-solidify in a locally smooth surface. the high frequency roughness drops over the surface with a lower frequency bump or texture pattern remaining from the re-solidification.

Abstract: Provided herein are textured substrates for thin-film solar cells. According to various embodiments, the textured substrates are characterized by substrate patterns exhibiting low-frequency roughness or flatness and long range order. The substrates may be metallic or non-metallic substrates, and in certain embodiments are stainless steel foils. According to various embodiments, the substrates may be provided in the form of a web, ready for deposition of thin-film photovoltaic stacks. Also provided are textured back contact thin films.

Abstract: Provided herein are methods of polishing, cleaning and texturing back contacts of thin-film solar cells. According to various embodiments, the methods involve irradiating sites on the back contact with laser beams to remove contaminants and/or smooth the surface of the back contact. The back contact, e.g., a molybdenum, copper, or niobium thin-film, is smoothed prior to deposition of the absorber and other thin-films of the photovoltaic stack. In certain embodiments, laser polishing of the back contact is used to enhance the diffusion barrier characteristics of the back contact layer, with all or a surface layer of the back contact becoming essentially amorphous. In certain embodiments, the adhesion of the absorber layer is enhanced by the textured back contact and by the presence of the amorphous metal at the deposition surface.

Abstract: Provided herein are methods of incorporating additives into thin-film solar cell substrates and back contacts. In certain embodiments, sodium is incorporated into a substrate or a back contact of a thin-film photovoltaic stack where it can diffuse into a CIGS or other absorber layer to improve efficiency and/or growth of the layer. The methods involve laser treating the substrate or back contact in the presence of a sodium (or sodium-containing) solid or vapor to thereby incorporate sodium into the surface of the substrate or back contact. In certain embodiments, the surface is simultaneously smoothed.

Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: A solar-cell module. The solar-cell module includes a plurality of solar cells that are electrically coupled together. The solar-cell module further includes an in-laminate-diode assembly electrically coupled with the plurality of solar cells. The in-laminate-diode assembly is configured to prevent power loss. The solar-cell module also includes a protective structure at least partially encapsulating the plurality of solar cells. In addition, the solar-cell module includes a plurality of external-connection mechanisms mounted to a respective plurality of edge regions of the protective structure. An external-connection mechanism of the plurality of external-connection mechanisms is configured to enable collection of current from the plurality of solar cells and to allow interconnection with at least one other external device.

Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: A method for smoothing the surface of a metallic substrate. The method includes providing a metallic substrate and smoothing a surface of the metallic substrate by irradiating the surface with a high-intensity energy source, such that the surface is smoothed to remove defects from the surface by creating an altered surface layer. The altered surface layer is configured to receive at least one layer in a fabrication process of an electronic device.