Patents by Inventor William James Sommerville

William James Sommerville has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10116711
    Abstract: A computing device determines a collaboration event in which users are participating. For instance, the users' computing devices may be located within a same location, the users' communication devices may be currently engaging in a common communication session, or calendar entries of the users' calendars may indicate that they are currently participating in a common session. The computing device determines data related to the collaboration event, and may filter this data to yield the data most related to the collaboration event. The computing device provides the data related to the collaboration event to at least one of the users participating in the collaboration event.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: October 30, 2018
    Assignee: Lenovo Enterprise Solutions (Singapore) PTE. LTD.
    Inventors: Gary David Cudak, Joseph Francis Herman, William James Sommerville, Laura Ann Weaver
  • Publication number: 20170171263
    Abstract: A computing device determines a collaboration event in which users are participating. For instance, the users' computing devices may be located within a same location, the users' communication devices may be currently engaging in a common communication session, or calendar entries of the users' calendars may indicate that they are currently participating in a common session. The computing device determines data related to the collaboration event, and may filter this data to yield the data most related to the collaboration event. The computing device provides the data related to the collaboration event to at least one of the users participating in the collaboration event.
    Type: Application
    Filed: December 14, 2015
    Publication date: June 15, 2017
    Inventors: Gary David Cudak, Joseph Francis Herman, William James Sommerville, Laura Ann Weaver
  • Publication number: 20090088008
    Abstract: Method and apparatus for installing a processor into electronic communication with a socket. The land grid array socket connector includes a socket housing secured to a circuit board and an array of upwardly extending pins for electronic communication with contact pads on the processor. The socket connector provides a carriage configured to receiving the processor through a lateral opening and support a perimeter edge of the processor. A mechanical linkage couples the carriage and the socket housing for substantially vertically translating the processor relative to the socket. A plurality of alignment features upwardly extends from the socket housing along the perimeter of the array of pins. Each of the alignment features has an inwardly-facing tapered surface for registering the edge of the processor and biasing the processor into a position where the array of contact pads are aligned with the array of pins as the processor is lowered.
    Type: Application
    Filed: October 2, 2007
    Publication date: April 2, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Justin Potok Bandholz, Jonathan Randall Hinkle, Clifton Ehrich Kerr, John Frank Nations, Jr., William James Sommerville
  • Patent number: 7507102
    Abstract: Method and apparatus for installing a processor into electronic communication with a socket. The land grid array socket connector includes a socket housing secured to a circuit board and an array of upwardly extending pins for electronic communication with contact pads on the processor. The socket connector provides a carriage configured to receiving the processor through a lateral opening and support a perimeter edge of the processor. A mechanical linkage couples the carriage and the socket housing for substantially vertically translating the processor relative to the socket. A plurality of alignment features upwardly extends from the socket housing along the perimeter of the array of pins. Each of the alignment features has an inwardly-facing tapered surface for registering the edge of the processor and biasing the processor into a position where the array of contact pads are aligned with the array of pins as the processor is lowered.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: March 24, 2009
    Assignee: International Business Machines Corporation
    Inventors: Justin Potok Bandholz, Jonathan Randall Hinkle, Clifton Ehrich Kerr, John Frank Nations, Jr., William James Sommerville