Abstract: Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.

Abstract: A method includes processing each of a plurality of lots with at least one first equipment and moving some of the plurality of lots to a first storage. For each of a plurality of second equipments, an expected dispatch time of one or more next lots for processing by the second equipment is determined. Each of the lots in the first storage is assigned to one of the plurality of second equipments on the basis of at least the determined expected dispatch times and moved to one of a plurality of second storages that is associated with one of the plurality of second equipments to which the respective lot was assigned. For each of the plurality of second equipments, each of the lots in the second storage associated with the second equipment is moved to the second equipment and are processed with the second equipment.

Abstract: Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.

Abstract: Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.

Abstract: Disclosed herein are methods and systems for semiconductor fabrication. In one embodiment, a method of semiconductor fabrication includes performing a process on substrates with an equipment unit to form processed substrates, communicating processing data from the equipment unit to a local scheduler and a universal scheduler, determining a priority of the processed substrates, and scheduling removal of processed substrates from the equipment unit and delivery of unprocessed substrates to the equipment unit by the local scheduler based on the processing data and the priority of the processed substrates.

Abstract: A method includes processing each of a plurality of lots with at least one first equipment and moving some of the plurality of lots to a first storage. For each of a plurality of second equipments, an expected dispatch time of one or more next lots for processing by the second equipment is determined Each of the lots in the first storage is assigned to one of the plurality of second equipments on the basis of at least the determined expected dispatch times and moved to one of a plurality of second storages that is associated with one of the plurality of second equipments to which the respective lot was assigned. For each of the plurality of second equipments, each of the lots in the second storage associated with the second equipment is moved to the second equipment and are processed with the second equipment.

Abstract: Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.

Abstract: Disclosed herein are methods and systems for semiconductor fabrication. In one embodiment, a method of semiconductor fabrication includes performing a process on substrates with an equipment unit to form processed substrates, communicating processing data from the equipment unit to a local scheduler and a universal scheduler, determining a priority of the processed substrates, and scheduling removal of processed substrates from the equipment unit and delivery of unprocessed substrates to the equipment unit by the local scheduler based on the processing data and the priority of the processed substrates.

Abstract: An automated material handling system that includes an extractor/buffer apparatus capable of simultaneously accessing multiple Work-In-Process (WIP) parts, thereby providing a highly efficient interface between WIP storage locations and transport equipment. The extractor/buffer apparatus includes multiple extractor/buffer modules, each module being configured to interface with a location for holding WIP parts that is a number of WIP parts deep. Each module includes a platform for holding multiple WIP parts. Further, multiple modules may be disposed side-by-side to form an extractor/buffer apparatus capable of handling multiple rows of WIP parts.