Patents by Inventor William John Rudik
William John Rudik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6841026Abstract: A simple, inexpensive, drillable, reduced CTE laminate and circuitized structures comprising the reduced CTE laminate, is provided. One embodiment of the reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0.05% to 0.3%, preferably from about 0.08% to 0.10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The method for making reduced CTE laminate and laminate structures comprises the following steps: providing non-woven quartz mat; providing a prepreg, preferably B-stage cured to not more than about 40%, preferably not more than 30% of full cure; sandwiching the non-woven quartz mat between two layers of prepreg, and reflowing the resin of the prepreg into the quartz mat.Type: GrantFiled: March 26, 2002Date of Patent: January 11, 2005Assignee: International Business Machines CorporationInventors: Lawrence Robert Blumberg, Robert Maynard Japp, William John Rudik, John Frank Surowka
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Patent number: 6739048Abstract: A process of fabricating a circuitized structure is provided. The process includes the steps of providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in the dielectric film; sputtering a metal seed layer on the dielectric film and the microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon.Type: GrantFiled: January 27, 2000Date of Patent: May 25, 2004Assignee: International Business Machines CorporationInventors: Gerald Walter Jones, Ross William Keesler, Voya Rista Markovich, William John Rudik, James Warren Wilson, William Earl Wilson
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Patent number: 6586352Abstract: A simple, inexpensive, drillable, reduced CTE laminate and circuitized structure comprising the reduced CTE laminate, is provided. The reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0.05% to 0.3%, preferably from about 0.08% to 0.10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The present invention also generally relates to a method for reducing the CTE of circuitized structures, and to methods for making reduced CTE laminate and circuitized structures comprising reduced CTE laminate.Type: GrantFiled: October 20, 2000Date of Patent: July 1, 2003Assignee: International Business Machines CorporationInventors: Lawrence Robert Blumberg, Robert Maynard Japp, William John Rudik, John Frank Surowka
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Publication number: 20030000081Abstract: A simple, inexpensive, drillable, reduced CTE laminate and circuitized structures comprising the reduced CTE laminate, is provided. One embodiment of the reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0.05% to 0.3%, preferably from about 0.08% to 0.10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The method for making reduced CTE laminate and laminate structures comprises the following steps: providing non-woven quartz mat; providing a prepreg, preferably B-stage cured to not more than about 40%, preferably not more than 30% of full cure; sandwiching the non-woven quartz mat between two layers of prepreg, and reflowing the resin of the prepreg into the quartz mat.Type: ApplicationFiled: March 26, 2002Publication date: January 2, 2003Applicant: International Business Machines CorporationInventors: Lawrence Robert Blumberg, Robert Maynard Japp, William John Rudik, John Frank Surowka
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Publication number: 20020078562Abstract: A process of fabricating a circuitized substrate is provided which comprising the steps of: providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in said dielectric film; sputtering a metal seed layer on the dielectric film and in said microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon.Type: ApplicationFiled: January 27, 2000Publication date: June 27, 2002Inventors: Gerald Walter Jones, Ross William Keesler, Voya Rista Markovich, William John Rudik, James Warren Wilson, William Earl Wilson
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Patent number: 6387830Abstract: A simple, inexpensive, drillable, reduced CTE laminate and circuitized structures comprising the reduced CTE laminate, is provided. The reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0.05% to 0.3%, preferably from about 0.08% to 0.10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The present invention also generally relates to a method for reducing the CTE of circuitized structures, and to methods for making reduced CTE laminate and circuitized structures comprising reduced CTE laminate.Type: GrantFiled: March 10, 1999Date of Patent: May 14, 2002Assignee: International Business Machines CorporationInventors: Lawrence Robert Blumberg, Robert Maynard Japp, William John Rudik, John Frank Surowka
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Patent number: 6136733Abstract: A simple, inexpensive, drillable, reduced CTE laminate and circuitized structures comprising the reduced CTE laminate, is provided. The reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0.05% to 0.3%, preferably from about 0.08% to 0.10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The present invention also generally relates to a method for reducing the CTE of circuitized structures, and to methods for making reduced CTE laminate and circuitized structures comprising reduced CTE laminate.Type: GrantFiled: June 13, 1997Date of Patent: October 24, 2000Assignee: International Business Machines CorporationInventors: Lawrence Robert Blumberg, Robert Maynard Japp, William John Rudik, John Frank Surowka
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Patent number: 6131279Abstract: A process of fabricating a circuitized substrate is provided which comprising the steps of: providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in said dielectric film; sputtering a metal seed layer on the dielectric film and in said microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon.Type: GrantFiled: January 8, 1998Date of Patent: October 17, 2000Assignee: International Business Machines CorporationInventors: Gerald Walter Jones, Ross William Keesler, Voya Rista Markovich, William John Rudik, James Warren Wilson, William Earl Wilson
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Patent number: 6096665Abstract: A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture as well as most of the interstices or openings, although some of the interstices or openings have holes where the coating does not completely fill in. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in any holes in the first coating. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets. This substantially reduces pinholing.Type: GrantFiled: July 9, 1997Date of Patent: August 1, 2000Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, Robert Maynard Japp, Kostantinos Papathomas, William John Rudik
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Patent number: 5981880Abstract: A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.Type: GrantFiled: August 20, 1996Date of Patent: November 9, 1999Assignee: International Business Machines CorporationInventors: Bernd Karl-Heinz Appelt, Anilkumar Chinuprasad Bhatt, James W. Fuller, Jr., John Matthew Lauffer, Voya Rista Markovich, William John Rudik, William Earl Wilson
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Patent number: 5955782Abstract: A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and attached to an organic card with the same passivation material. A semiconductor die may be adhered to the coated die bond pad with either the same passivation material or a common die bond adhesive. Alternatively, the passivation material is coated only on the portion of the die bond pad where the die is attached, and common die bond adhesive attaches the die bond pad to the organic card.Type: GrantFiled: November 4, 1997Date of Patent: September 21, 1999Assignee: International Business Machines CorporationInventors: Stephen John Kosteva, David Michael Passante, William John Rudik, David John Russell, Jonathan Craig Whitcomb
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Patent number: 5919525Abstract: A method and resultant article are provided which optimize the adhesion of resin to the glass fibers in fiberglass cloth impregnated with a resin and also optimize the adhesion of the impregnated resin to metal sheets laminated to the resin-impregnated cloth. The fiberglass is treated in two or more passes. On the first pass, the fiberglass is impregnated with a first resin which is optimized for adherence to glass fibers and the coated resin is partially cured. In a last pass, the fiberglass is impregnated with a second resin, which is different from said first resin, and is optimized for bonding to metal. The second resin is then partially cured. The first and second resins are selected such that they form a bond with each other when cured.Type: GrantFiled: July 9, 1997Date of Patent: July 6, 1999Assignee: International Business Macjines CoporationInventors: Bernd Karl Appelt, Robert Maynard Japp, Kostantinos Papathomas, William John Rudik
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Patent number: 5874370Abstract: A method and resultant article are provided which optimize the adhesion of resin to the glass fibers in fiberglass cloth impregnated with a resin and also optimize the adhesion of the impregnated resin to metal sheets laminated to the resin-impregnated cloth. The fiberglass is treated in two or more passes. On the first pass, the fiberglass is impregnated with a first resin which is optimized for adherence to glass fibers and the coated resin is partially cured. In a last pass, the fiberglass is impregnated with a second resin, which is different from said first resin, and is optimized for bonding to metal. The second resin is then partially cured. The first and second resins are selected such that they form a bond with each other when cured.Type: GrantFiled: July 9, 1997Date of Patent: February 23, 1999Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, Robert Maynard Japp, Kostantinos Papathomas, William John Rudik
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Patent number: 5871819Abstract: A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture as well as most of the interstices or openings, although some of the interstices or openings have holes where the coating does not completely fill in. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in any holes in the first coating. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets. This substantially reduces pinholing.Type: GrantFiled: July 9, 1997Date of Patent: February 16, 1999Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, Robert Maynard Japp, Kostantinos Papathomas, William John Rudik
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Patent number: 5866203Abstract: A method and resultant article are provided which optimize the adhesion of resin to the glass fibers in fiberglass cloth impregnated with a resin and also optimize the adhesion of the impregnated resin to metal sheets laminated to the resin-impregnated cloth. The fiberglass is treated in two or more passes. On the first pass, the fiberglass is impregnated with a first resin which is optimized for adherence to glass fibers and the coated resin is partially cured. In a last pass, the fiberglass is impregnated with a second resin, which is different from said first resin, and is optimized for bonding to metal. The second resin is then partially cured. The first and second resins are selected such that they form a bond with each other when cured.Type: GrantFiled: July 9, 1997Date of Patent: February 2, 1999Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, Robert Maynard Japp, Kostantinos Papathomas, William John Rudik
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Patent number: 5858461Abstract: A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture as well as most of the interstices or openings, although some of the interstices or openings have holes where the coating does not completely fill in. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in any holes in the first coating. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets. This substantially reduces pinholing.Type: GrantFiled: July 9, 1997Date of Patent: January 12, 1999Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, Robert Maynard Japp, Kostantinos Papathomas, William John Rudik
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Patent number: 5780366Abstract: A method and resultant article are provided which optimize the adhesion of resin to the glass fibers in fiberglass cloth impregnated with a resin and also optimize the adhesion of the impregnated resin to metal sheets laminated to the resin-impregnated cloth. The fiberglass is treated in two or more passes. On the first pass, the fiberglass is impregnated with a first resin which is optimized for adherence to glass fibers and the coated resin is partially cured. In a last pass, the fiberglass is impregnated with a second resin, which is different from said first resin, and is optimized for bonding to metal. The second resin is then partially cured. The first and second resins are selected such that they form a bond with each other when cured.Type: GrantFiled: September 10, 1996Date of Patent: July 14, 1998Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, Robert Maynard Japp, Kostantinos Papathomas, William John Rudik
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Patent number: 5719090Abstract: A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture as well as most of the interstices or openings, although some of the interstices or openings have holes where the coating does not completely fill in. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in any holes in the first coating. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets. This substantially reduces pinholing.Type: GrantFiled: September 10, 1996Date of Patent: February 17, 1998Assignee: International Business Machines CorporationInventors: Bernd Karl Appelt, Robert Maynard Japp, Kostantinos Papathomas, William John Rudik