Patents by Inventor William John Ryan

William John Ryan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Backside laser dicing system
    Patent number: 3970819
    Abstract: A wafer of semiconductor material having a plurality of units defined on its face is subdivided by treating the wafer, on its back or reverse side, in the kerf regions between the units, where division of the units is desired, such that the material of the wafer in the treated kerf regions is converted to a material having a breaking strength lower than the breaking strength of the semiconductor material.
    Type: Grant
    Filed: November 25, 1974
    Date of Patent: July 20, 1976
    Assignee: International Business Machines Corporation
    Inventors: Gerald Alan Gates, William John Ryan