Patents by Inventor William Johnson Chappell

William Johnson Chappell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6992636
    Abstract: A substrate (300) for an RF device includes a plurality of layers (102) of dielectric material cofired in a stack. The plurality of layers (102) is formed from a material having a permittivity. Selected ones of the layers (102) have a pattern of perforations (106) formed in at least one perforated area (104). The perforated areas (104) are generally aligned with one another in the stack to lower one or more of an effective value of a permittivity and a loss tangent in a least one spatially defined region (504) of the substrate (300).
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: January 31, 2006
    Assignee: Harris Corporation
    Inventors: Dennis Tebbe, Thomas Smyth, William Johnson Chappell
  • Patent number: 6911941
    Abstract: A substrate (300) for an RF device includes a plurality of layers (102) of dielectric material cofired in a stack. The plurality of layers (102) is formed from a material having a permittivity. Selected ones of the layers (102) have a pattern of perforations (106) formed in at least one perforated area (104). The perforated areas (104) are generally aligned with one another in the stack to lower one or more of an effective value of a permittivity and a loss tangent in a least one spatially defined region (504) of the substrate (300).
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: June 28, 2005
    Assignee: Harris Corporation
    Inventors: Dennis Tebbe, Thomas Smyth, William Johnson Chappell
  • Publication number: 20040257279
    Abstract: A substrate (300) for an RF device includes a plurality of layers (102) of dielectric material cofired in a stack. The plurality of layers (102) is formed from a material having a permittivity. Selected ones of the layers (102) have a pattern of perforations (106) formed in at least one perforated area (104). The perforated areas (104) are generally aligned with one another in the stack to lower one or more of an effective value of a permittivity and a loss tangent in a least one spatially defined region (504) of the substrate (300).
    Type: Application
    Filed: June 19, 2003
    Publication date: December 23, 2004
    Inventors: Dennis Tebbe, Thomas Smyth, William Johnson Chappell
  • Patent number: 6825741
    Abstract: The concept of electromagnetic bandgaps (EBG) is used to develop a high quality filter that can be integrated monolithically with other components due to a reduced height, planar design. Coupling adjacent defect elements in a periodic lattice creates a filter characterized by ease of fabrication, high-Q performance, high port isolation and integrability to planar or 3-D circuit architectures. The filter proof of concept has been demonstrated in a metallo-dielectric lattice. The measured and simulated results of 2-, 3- and 6-pole filters are presented at 10.7 GHz, along with the equivalent circuits.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: November 30, 2004
    Assignee: The Regents of the University Michigan
    Inventors: William Johnson Chappell, Linda P. B. Katehi, Matthew Patrick Little
  • Publication number: 20030020567
    Abstract: The concept of electromagnetic bandgaps (EBG) is used to develop a high quality filter that can be integrated monolithically with other components due to a reduced height, planar design. Coupling adjacent defect elements in a periodic lattice creates a filter characterized by ease of fabrication, high-Q performance, high port isolation and integrability to planar or 3-D circuit architectures. The filter proof of concept has been demonstrated in a metallodielectric lattice. The measured and simulated results of 2, 3 and 6 pole filters are presented at 10.7 GHz, along with the equivalent circuits.
    Type: Application
    Filed: June 12, 2002
    Publication date: January 30, 2003
    Inventors: William Johnson Chappell, Linda P.B. Katehi, Matthew Patrick Little