Abstract: A method includes receiving, during a period of time, a continuous wave laser beam at an acousto-optic deflector (AOD) having a first AOD and a second AOD. A plurality of laser pulses is generated from the received beam using the first acousto-optic deflector (AOD) to the laser beam along a first axis and using the second AOD to deflect the laser beam deflected by the first AOD along a second axis.

Abstract: A method and system increase the quality of results achieved by laser micromachining systems. Data relating to parameters controlling laser micromachining process are recorded during the micromachining process, identified by the feature associated with the parameters used to micromachine, and stored on the system. The stored data can be either retrieved during the micromachining process to enable real time control or retrieved after workpiece processing to conduct statistical process control.

Abstract: A specially shaped laser pulse energy profile characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.

Abstract: High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular and spiral laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory to an entry position within the specimen at which laser beam pulse emissions are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.