Patents by Inventor William Joseph Nepsha

William Joseph Nepsha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hole seal for enclosure
    Patent number: 7518062
    Abstract: A hole seal for an enclosure includes a body having a threaded portion, and a nut having an inner threaded portion to receive the threaded portion of the body, the nut including a first outer flange having first diameter and a second outer flange having a second diameter, larger than the first diameter.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: April 14, 2009
    Assignee: Hoffman Enclosures, Inc.
    Inventors: William Joseph Nepsha, Steven Edward Hendricks
  • HOLE SEAL FOR ENCLOSURE
    Publication number: 20080111368
    Abstract: A hole seal for an enclosure includes a body having a threaded portion, and a nut having an inner threaded portion to receive the threaded portion of the body, the nut including a first outer flange having first diameter and a second outer flange having a second diameter, larger than the first diameter.
    Type: Application
    Filed: November 9, 2006
    Publication date: May 15, 2008
    Applicant: HOFFMAN ENCLOSURES, INC
    Inventors: William Joseph Nepsha, Steven Edward Henricks
  • Electrical enclosure having improved sealing and shielding component and method of manufacture thereof
    Patent number: 7071409
    Abstract: An electrical enclosure having an improved sealing and shielding component and a method of manufacturing such an enclosure is provided. In accordance with an embodiment of the invention, a wire mesh is positioned against the surface of the enclosure. While the wire mesh is being positioned against the enclosure surface, a foam is formed on the enclosure surface adjacent the wire mesh. The foam generally adheres to the enclosure surface and holds the wire mesh in place. In accordance with one aspect of the invention, the foam has a height equal to or greater than the height of the wire mesh. The improved sealing and shielding components can, for example, improve the sealing and shielding of the electrical enclosure as compared to conventional electrical enclosures. The present electrical enclosure may, for example, also reduce the cost of manufacturing electrical enclosures.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: July 4, 2006
    Assignee: Hoffman Enclosures, Inc.
    Inventors: John Emil Richard, William Joseph Nepsha, Timothy Lloyd Mullen, Thomas R. Hurney, Paul Rutherford, Jr., Tom Erickson, Chuck Lavigne, Thomas E. Anderson
  • Electrical enclosure having improved sealing and shielding component and method of manufacture thereof
    Publication number: 20040012932
    Abstract: An electrical enclosure having an improved sealing and shielding component and a method of manufacturing such an enclosure is provided. In accordance with an embodiment of the invention, a wire mesh is positioned against the surface of the enclosure. While the wire mesh is being positioned against the enclosure surface, a foam is formed on the enclosure surface adjacent the wire mesh. The foam generally adheres to the enclosure surface and holds the wire mesh in place. In accordance with one aspect of the invention, the foam has a height equal to or greater than the height of the wire mesh. The improved sealing and shielding components can, for example, improve the sealing and shielding of the electrical enclosure as compared to conventional electrical enclosures. The present electrical enclosure may, for example, also reduce the cost of manufacturing electrical enclosures.
    Type: Application
    Filed: January 31, 2003
    Publication date: January 22, 2004
    Applicant: Hoffman Enclosures, Inc.
    Inventors: John Emil Richard, William Joseph Nepsha, Timothy Lloyd Mullen, Thomas R. Hurney, Paul Rutherford, Tom Erickson, Chuck Lavigne, Thomas E. Anderson
  • Electrical enclosure having improved sealing and shielding component and method of manufacture thereof
    Patent number: 6408506
    Abstract: An electrical enclosure having an improved sealing and shielding component and a method of manufacturing such an enclosure is provided. In accordance with an embodiment of the invention, a wire mesh is positioned against the surface of the enclosure. While the wire mesh is being positioned against the enclosure surface, a foam is formed on the enclosure surface adjacent the wire mesh. The foam generally adheres to the enclosure surface and holds the wire mesh in place. In accordance with one aspect of the invention, the foam has a height equal to or greater than the height of the wire mesh. The improved sealing and shielding components can, for example, improve the sealing and shielding of the electrical enclosure as compared to conventional electrical enclosures. The present electrical enclosure may, for example, also reduce the cost of manufacturing electrical enclosures.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: June 25, 2002
    Assignee: Hoffman Enclosures, Inc.
    Inventors: John Emil Richard, William Joseph Nepsha, Timothy Lloyd Mullen, Thomas R. Hurney, Paul Rutherford, Jr.
  • Electrical enclosure having improved sealing and shielding component and method of manufacture thereof
    Publication number: 20010009194
    Abstract: An electrical enclosure having an improved sealing and shielding component and a method of manufacturing such an enclosure is provided. In accordance with an embodiment of the invention, a wire mesh is positioned against the surface of the enclosure. While the wire mesh is being positioned against the enclosure surface, a foam is formed on the enclosure surface adjacent the wire mesh. The foam generally adheres to the enclosure surface and holds the wire mesh in place. In accordance with one aspect of the invention, the foam has a height equal to or greater than the height of the wire mesh. The improved sealing and shielding components can, for example, improve the sealing and shielding of the electrical enclosure as compared to conventional electrical enclosures. The present electrical enclosure may, for example, also reduce the cost of manufacturing electrical enclosures.
    Type: Application
    Filed: February 28, 2001
    Publication date: July 26, 2001
    Applicant: Hoffman Enclosures, Inc.
    Inventors: John Emil Richard, William Joseph Nepsha, Timothy Mullen, Thomas Hurney, Paul Rutherford Jr.
  • Electrical enclosure having improved sealing and shielding component and method of manufacture thereof
    Patent number: 6188014
    Abstract: An electrical enclosure having an improved sealing and shielding component and a method of manufacturing such an enclosure is provided. In accordance with an embodiment of the invention, a wire mesh is positioned against the surface of the enclosure. While the wire mesh is being positioned against the enclosure surface, a foam is formed on the enclosure surface adjacent the wire mesh. The foam generally adheres to the enclosure surface and holds the wire mesh in place. In accordance with one aspect of the invention, the foam has a height equal to or greater than the height of the wire mesh. The improved sealing and shielding components can, for example, improve the sealing and shielding of the electrical enclosure as compared to conventional electrical enclosures. The present electrical enclosure may, for example, also reduce the cost of manufacturing electrical enclosures.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: February 13, 2001
    Assignee: Hoffman Enclosures, Inc.
    Inventors: John Emil Richard, William Joseph Nepsha, Timothy Lloyd Mullen, Thomas R. Hurney, Paul Rutherford, Jr.