Abstract: A moisture-curable silicone hot melt pressure-sensitive adhesive composition is disclosed, said composition comprising(i) a solid hydroxyl-functional organopolysiloxane resin comprising R.sub.3 SiO.sub.1/2 siloxane units and SiO.sub.4/2 siloxane units in a molar ratio of 0.5/1 to 1.2/1, respectively, wherein R is selected from hydrocarbon and halogenated hydrocarbon radicals and said hydroxyl content is 1.2 to 6 percent by weight;(ii) an alkoxy-functional diorganopolysiloxane polymer having a viscosity at 25.degree. C. of 20 to <100,000 centipoise, the weight ratio of said resin to said polymer being in the range 40:60 to 80:20;(iii) a silane of the formula R'.sub.4-y SiX.sub.