Abstract: Provided are electronic device packages and their methods of formation. The electronic device packages include a sealed volume enclosing an electronic device and a feedthrough into the sealed volume for electrical connection of the electronic device. Provided are optoelectronic device packages and their methods of formation. The optoelectronic device packages include a first substrate and lid attached to the first substrate forming an enclosed volume. An optoelectronic device is disposed within the enclosed volume and a wick stop for preventing solder flow is provided. Provided are prism-coupled optical assemblies which allow for the coupling of light between an optical component, such as a laser, and an integrated optical waveguide through a prism.

Abstract: An optical transceiver includes structures that define an electrical connector port for allowing connection of an electrical connector to an optical subassembly of the transceiver, and structures that define a vent surrounding at least portions of the connector port, whereby the vent allows bidirectional passage of air therethrough. Included in the transceiver are structures that define electromagnetic interference shielding and selectively transfer heat of heat generating electronic components by conduction to a transceiver housing. Methods of cooling the transceiver by ventilation and internal heat conduction are present.

Abstract: The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.

Abstract: A method of cooling an optical transceiver that is mountable in a wall opening and a method of cooling a data transfer system in combination with an optical transceiver is described. An optical transceiver is provided that has a form factor and one end portion that is insertable within a wall opening in a wall. Ambient air is ventilated over a major surface portion of the optical transceiver by mounting said end portion to the wall opening so that at least one vent is formed within confines of the wall opening. The vent allows air to pass between the exterior and interior of the enclosure, and over the major surface portion of the optical transceiver.

Abstract: The invention relates to a compact transmitter optical sub-assembly (OSA), which can be used in small form factor optical transceivers. To limit back reflections from entering the laser cavity, the laser is disposed on a silicon optical bench (SiOB) at an acute angle to the longitudinal axis of the OSA. A portion of the light from the laser cavity passes through the back end of the laser cavity for measuring by a monitor photodiode. A rear beam steering lens redirects the portion of light into a v-groove in the SiOB and off of a reflective surface formed in the end thereof to the monitor photodiode, which is positioned face down over the v-groove.

Abstract: An optical transceiver includes structures that define an electrical connector port for allowing connection of an electrical connector to an optical subassembly of the transceiver, and structures that define a vent surrounding at least portions of the connector port, whereby the vent allows bidirectional passage of air therethrough. Included in the transceiver are structures that define electromagnetic interference shielding and selectively transfer heat of heat generating electronic components by conduction to a transceiver housing. Methods of cooling the transceiver by ventilation and internal heat conduction are present.

Abstract: The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

Abstract: An optical transceiver includes structures that define an electrical connector port for allowing connection of an electrical connector to an optical subassembly of the transceiver, and structures that define a vent surrounding at least portions of the connector port, whereby the vent allows bidirectional passage of air therethrough. Included in the transceiver are structures that define electromagnetic interference shielding and selectively transfer heat of heat generating electronic components by conduction to a transceiver housing. Methods of cooling the transceiver by ventilation and internal heat conduction are present.

Abstract: Methods and arrangements for providing compact optical paths between an optical connector, such as an MTRJ connector, and optoelectronic chips contained in TO cans. The methods and arrangements employed for creating the optical paths include the use of fibers that are not prone to fail from bending stresses, or waveguides.

Abstract: An optical signal transceiver subassembly is mounted on a lead frame for further attachment to an electronic printed circuit board. The optical subassembly is comprised of a solid-state laser, a pair of photo-detectors, an over-mold of transparent material having shapes forming the exposed surface thereof, the surface and a selective silvering of a portion thereof defining a beam-splitter mirror and an interior reflective focusing surface, preferably in the shape of a partial cylindrical surface. The beam-splitter mirror is lightly silvered and the cylindrical surface is silvered to enhance the reflection of the laser beam. The optical subassembly is further enclosed with a housing incorporating a pair of lenses and alignment pins. The lenses focus the data stream of optical light signals onto the end of the outgoing optical fiber and the data stream of optical light signals from the incoming optical fiber onto and through the beam-splitter and onto a first photo-detector.

Abstract: A switchable bandwidth optical receiver is implemented in a front-end of the receiver in at least one of three ways. A switchable impedance may be provided at the input to a preamplifier of the front end, the preamplifier of the front-end may have a switchable impedance therein, and/or a switchable filter may be provided at an output of the preamplifier.

Abstract: A structure that includes a substrate, typically a semiconductor chip such as a VCSEL or photodetector chip, and a guide for aligning a signal conveying device, typically an optical fiber, to a transducer such as an optoelectronic device on the semiconductor chip. The guide is formed, in a preferred embodiment, by lithographically exposing and developing a thick layer of photoresist. The structure is assembled by placing and securing the signal conveying device into a cavity-like region of the guide.

Abstract: The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host a transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.

Abstract: A latch is controlled to latch and unlatch a device by using a portion of the insertion and extraction movement of the device being latched. The latch incorporates a pivoted latching member carried on the device being latched. The end or latching surface is positionable behind a latch bar, preventing the extraction of the latched device. The latch member is displaced to latch or release by a spring disposed between the frame of the device being latched and the latch member. When the actuator member is withdrawn from its ineffective position and if the latch arm occupies a latched position, the actuator member engages surfaces on the latch member and the module frame which are too closely spaced to permit free passage of the engaging portion of the actuator. This engagement with the surfaces results in spreading the engaged portions of the module frame and the latch member, thereby pivoting the latch member to unlatch the latching end of the latch member from a retaining surface.

Abstract: The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.

Abstract: An electromagnetic radiation shield useful to attenuate or prevent the escape of electromagnetic radiation from the front of transceiver opto-electronic subassemblies resident in an opening or port in the housing of an electronic system is formed with both an aperture for each barrel of the opto-electronic subassemblies and a plurality of extensions projecting outwardly from the shield. The distal ends of the extensions are bent or shaped to form smoothly curved contact surfaces that project outside the transceiver module to make contact with a grounded member of the housing or other electrically grounded portion of the electronic system of which the transceiver module is a part. The electromagnetic radiation shield is assembled with the transceiver subassemblies and disposed within a transceiver module to be inserted into a communications port of a computer or server. The transceiver module contains elements that may generate and radiate electromagnetic energy.

Abstract: The invention relates to a transmitter optical sub-assembly (TOSA) for use in high data rate (10 Gb/s or higher) small form factor transceivers. A flexible cable electrical connector, a ceramic feedthrough, and a differential drive disposed adjacent the laser result in improved optical eye-diagrams with increased design margin. A heat spreader incorporated in the housing of the TOSA ensures constant performance at the high data rates.

Abstract: Disclosed is a semiconductor structure and manufacturing process for making an integrated FET and photodetector optical receiver on a semiconductor substrate. A FET is formed by forming at least one p channel in a p-well of the substrate and forming at least one n channel in the p-well of the substrate. A p-i-n photodetector is formed in the substrate by forming at least one p channel in an absorption region of the substrate when forming the at least one p channel in the p well of the FET and forming at least one n channel in the absorption region of the substrate when forming the at least one n channel in the p-well of the FET.

Abstract: A push-to-release latching mechanism for retaining a transceiver module in a communication port of a computer or server is provided with a beam spring structure for positional restoration of the latch member, and the latch is supported and moveable relative to the host transceiver module. The latch member may be formed to include camming surfaces that facilitate the insertion of the transceiver module into a communication port and mate with a guide rail and connector resident in a communication port. The latch member may be adapted to latch with a rigid latch bar or a cantilevered spring. Additionally, the latch may be formed with a camming surface which insures that the latch is displaced to a latching position whenever network cables are connected to the transceiver module by camming the latch into the secure, latched position and subsequently preventing the latch from moving to an insecure or unlatched position.

Abstract: An electrical connector system has two connectors, one of which is included in a module mateable with the other connector in a pluggable manner. The other connector includes a body and two or more electrical contacts. The body of that electrical connector includes a spring that provides a combined lock-down force and kick-out force. The lock-down force biases the module against the other connector, thereby providing a secure electrical and mechanical connection. The kick-out force biases the module away from the other connector to separate or eject the module when a user actuates a release mechanism. The module also includes a slot that engages a projection on the other connector to promote alignment of the mating electrical contacts.