Patents by Inventor William K. Pederson, Jr.

William K. Pederson, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount package for toroids
    Patent number: 4611092
    Abstract: A surface mount package for toroids or the like inductive elements has the element sandwiched between two non-conductive plates. Spring clips hold the sandwich together, and the element leads are connected to the clips. The assembly is potted, leaving only one end of the clips exposed for surface mounting on a circuit board.
    Type: Grant
    Filed: February 21, 1985
    Date of Patent: September 9, 1986
    Assignee: Tektronix, Inc.
    Inventors: William K. Pederson, Jr., John J. Tils