Patents by Inventor William Katona

William Katona has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4985107
    Abstract: Electrical circuit components such as integrated circuit chips with plural closely-spaced mounting feet/terminals are mounted on surface-mount connection pads on a printed circuit board very simply and easily by mechanical means. An alignment pattern member having very precisely located holes matching the array of pads on the printed circuit board is used. The feet of the component first are fitted into the holes in the pattern to orient and locate them accurately, then the pattern and the component are separated from one another, and the component is placed with the feet on the pads. Preferably, the component is picked up with a vacuum pick-up device to remove it from the pattern, an is lowered onto the pads of the circuit board by the same mechanism.
    Type: Grant
    Filed: March 1, 1988
    Date of Patent: January 15, 1991
    Assignee: SCI Systems, Inc.
    Inventors: Walter J. Conroy, William Katona