Abstract: The present invention relates to a ruggedized enclosure for housing and protecting electronic circuits. The enclosure utilizes a top compartment for housing the circuit and a cooling assembly rigidly coupled to the top compartment. The cooling assembly utilizes a passive radiator to form a rigid truss plate structure. The truss plate structure rigidifies the enclosure helping to protect the enclosure and circuit from destructive shock events and destructive vibration events. The cooling assembly further provides an efficient heat exchange for removing heat from the electronic circuit. A method for protecting an electronic circuit utilizing a rigid truss plate structure is also provided.

Abstract: The present invention relates to a liquid cooling assembly for cooling electronic components. The liquid cooling assembly contains a heat spreader plate rigidly coupled to a structural foam layer for providing mechanical support and thermal dissipation for the electronic components. A fluid channel, rigidly coupled to the structural foam, is provided for directing a cooling fluid in the plane of the heat spreader and a bottom plate rigidly coupled to the structural foam to protect the electronic components against one or more destructive shock events and to provide thermal dissipation of heat generated by the electronic components. The present invention also provides a maze structure in the liquid cooling assembly to increase structural stability against destructive shock events. The present invention relates to a ruggedized electronics enclosure for housing electronic components containing a top compartment configured to house the electronic components.