Patents by Inventor William Kennedy LANDLES

William Kennedy LANDLES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200366066
    Abstract: A laser diode array for a projector is provided. The laser diode array includes a first subset of laser diode devices configured to emit a first wavelength. The laser diode array further includes a second subset of the laser diode devices. Each of the laser diode devices of the second subset comprises: a wavelength selective optical feedback laser diode configured to emit according to a gain curve that includes the first wavelength; and a notch filter configured to reflect a second wavelength of the gain curve into the wavelength selective optical feedback laser diode to cause the wavelength selective optical feedback laser diode to amplify the second wavelength, the second wavelength different from the first wavelength.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 19, 2020
    Inventor: William Kennedy LANDLES
  • Patent number: 9976844
    Abstract: A chip package includes a housing, one or more electrical connections coupled to an exterior of the housing, a photonic integrated circuit, and a scanning unit. Both the photonic integrated circuit and the scanning unit are disposed within the housing. The photonic integrated circuit has at least one waveguide designed to guide a beam of light. The scanning unit is designed to laterally scan the beam of light across a focal plane outside of the housing. The scanning unit is aligned with the photonic integrated circuit such that the beam of light is coupled between the photonic integrated circuit and the scanning unit.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: May 22, 2018
    Assignee: Medlumics S.L.
    Inventors: Juan Lloret Soler, Juan Sancho Durá, José Luis Rubio Guivernau, Eduardo Margallo Balbás, William Kennedy Landles, Andrés Cifuentes, Blair Ungar, Kirill Zinoviev
  • Publication number: 20160238371
    Abstract: A chip package includes a housing, one or more electrical connections coupled to an exterior of the housing, a photonic integrated circuit, and a scanning unit. Both the photonic integrated circuit and the scanning unit are disposed within the housing. The photonic integrated circuit has at least one waveguide designed to guide a beam of light. The scanning unit is designed to laterally scan the beam of light across a focal plane outside of the housing. The scanning unit is aligned with the photonic integrated circuit such that the beam of light is coupled between the photonic integrated circuit and the scanning unit.
    Type: Application
    Filed: February 3, 2016
    Publication date: August 18, 2016
    Inventors: Juan LLORET SOLER, Juan SANCHO DURÁ, José Luis RUBIO GUIVERNAU, Eduardo MARGALLO BALBÁS, William Kennedy LANDLES, Andrés CIFUENTES, Blair UNGAR, Kirill ZINOVIEV