Patents by Inventor William Kennet Oyler, III

William Kennet Oyler, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packing material and method
    Patent number: 8011511
    Abstract: A packing material is made of a thin plastic bag with compressible beads inside, and with the pressure inside the bag being sufficiently less than the ambient pressure outside the bag to keep the beads in a non-free-flowing state, the packing material being generally flat, with a generally constant cross-sectional thickness and having at least one trough of lesser cross-sectional thickness to serve as a bend line.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: September 6, 2011
    Assignee: Simpak International LLC
    Inventors: Max D. Oyler, William Kennet Oyler, III, Michael J. Lyons, Ron Smith, Charles W. Woods, II
  • PACKING MATERIAL AND METHOD
    Publication number: 20090199513
    Abstract: A packing material is made of a thin plastic bag with compressible beads inside, and with the pressure inside the bag being sufficiently less than the ambient pressure outside the bag to keep the beads in a non-free-flowing state, the packing material being generally flat, with a generally constant cross-sectional thickness and having at least one trough of lesser cross-sectional thickness to serve as a bend line.
    Type: Application
    Filed: February 10, 2009
    Publication date: August 13, 2009
    Applicant: Simpak International, LLC
    Inventors: Max D. Oyler, William Kennet Oyler, III, Michael J. Lyons, Ron Smith, Charles W. Woods, II