Patents by Inventor William Kent Gregory

William Kent Gregory has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Planar laminate substrate and method for fabricating organic laminate substrate PCBS, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways
    Patent number: 7955485
    Abstract: The present invention is a method of manufacturing miniaturized organic laminate substrate PCB, semiconductors, semiconductor wafers and semiconductor devices that have a 50% reduction in physical dimensions with respect to prior art existing organic laminate substrate PCB, semiconductors, semiconductor wafers and semiconductor devices. The base planar substrate has a vapor deposited 0.02 mil thick copper cladding thereon its first planar surface that has been affixed atop a hydrophillic layer, and an adhesive layer on its second planar surface. The copper cladding has sufficient peel strength and a low enough etch factor so as to allow 10 micron (or smaller) electrical trace pathways to be formed thereon when the steps of a specifically designed manufacturing methodology are followed.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: June 7, 2011
    Inventor: William Kent Gregory
  • PLANAR LAMINATE SUBSTRATE AND METHOD FOR FABRICATING ORGANIC LAMINATE SUBSTRATE PCBS, SEMICONDUCTORS, SEMICONDUCTOR WAFERS AND SEMICONDUCTOR DEVICES HAVING MINIATURIZED ELECTRICAL PATHWAYS
    Publication number: 20100209682
    Abstract: The present invention is a method of manufacturing miniaturized organic laminate substrate PCB, semiconductors, semiconductor wafers and semiconductor devices that have a 50% reduction in physical dimensions with respect to prior art existing organic laminate substrate PCB, semiconductors, semiconductor wafers and semiconductor devices. The base planar substrate has a vapor deposited 0.02 mil thick copper cladding thereon its first planar surface that has been affixed atop a hydrophillic layer, and an adhesive layer on its second planar surface. The copper cladding has sufficient peel strength and a low enough etch factor so as to allow 10 micron (or smaller) electrical trace pathways to be formed thereon when the steps of a specifically designed manufacturing methodology are followed.
    Type: Application
    Filed: May 3, 2010
    Publication date: August 19, 2010
    Inventor: William Kent Gregory
  • Planar laminate substrate and method for fabricating organic laminate substrate PCBS, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways
    Publication number: 20100015440
    Abstract: The present invention is a method of manufacturing miniaturized organic laminate substrate PCB, semiconductors, semiconductor wafers and semiconductor devices that have a 50% reduction in physical dimensions with respect to prior art existing organic laminate substrate PCB, semiconductors, semiconductor wafers and semiconductor devices. The base planar substrate has a vapor deposited 0.02 mil thick copper cladding thereon its first planar surface that has been affixed atop a hydrophillic layer, and an adhesive layer on its second planar surface. The copper cladding has sufficient peel strength and a low enough etch factor so as to allow 10 micron (or smaller) electrical trace pathways to be formed thereon when the steps of a specifically designed manufacturing methodology are followed.
    Type: Application
    Filed: July 17, 2008
    Publication date: January 21, 2010
    Inventor: William Kent Gregory