Abstract: Embodiments of methods, apparatuses, devices, and/or systems for optical are disclosed.

Abstract: An optical lens structure includes a substantially transparent substrate a lens array attached to the substrate with lenses of the lens array situated opposite the substrate and packaging material surrounding at least the periphery of the lens array, the packaging material including at least two alignment holes which are aligned with respect to positions of the lenses. In one example, the structure is fabricated by attaching a lens array to a substrate with lenses of the lens array situated opposite the substrate, surrounding a periphery of the lens array with a packaging material, the packaging material being attached to the substrate, planarizing the packaging material, and providing alignment holes through the packaging material.

Abstract: A transmission line structure includes first and second mutually separated strip conductors lying on an upper side of an upper dielectric sheet, and a ground conductor juxtaposed with the lower side of the upper dielectric sheet. A further strip conductor lies on a lower side of a lower dielectric sheet, with its ends registered with the ends of the first and second strip conductors. A gap in the further strip conductor is controllably bridged by a MEMS switch element, which may lie below the second dielectric sheet or in a cavity defined in the second dielectric sheet.

Abstract: A method of fabricating an integrated optoelectronic circuit. The method includes positioning a microchip on a first flexible dielectric substrate. A polymer electro-optic waveguide is positioned on or within the first flexible dielectric substrate. A ground electrode is positioned along the electro-optic waveguide. A signal electrode is positioned along the electro-optic waveguide opposite the ground electrode. A first patterned metallization layer is applied to the first flexible dielectric substrate. A second flexible dielectric substrate is positioned along the first flexible dielectric substrate. A plurality of via openings are provided in the first and second flexible dielectric substrates. A second patterned metallization layer is applied to the second flexible dielectric substrate.

Abstract: A method of fabricating an integrated optoelectronic circuit. The method includes positioning a microchip on a first flexible dielectric substrate. A polymer electro-optic waveguide is positioned on or within the first flexible dielectric substrate. A ground electrode is positioned along the electro-optic waveguide. A signal electrode is positioned along the electro-optic waveguide opposite the ground electrode. A first patterned metallization layer is applied to the first flexible dielectric substrate. A second flexible dielectric substrate is positioned along the first flexible dielectric substrate. A plurality of via openings are provided in the first and second flexible dielectric substrates. A second patterned metallization layer is applied to the second flexible dielectric substrate.

Abstract: The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.