Abstract: A wheel assembly comprises a wheel, a tire mounted to the wheel, a tire condition sensor unit, and a sensor mount. The sensor mount mounts the sensor unit to an outside diameter surface of a rim of the wheel in a desired circumferential mounting location relative to the wheel, and comprises an endless loop self-tightening device positioned around the wheel.

Abstract: A wheel assembly comprises a wheel, a tire mounted to the wheel, a tire condition sensor unit, and a sensor mount. The sensor mount mounts the sensor unit to an outside diameter surface of a rim of the wheel in a desired circumferential mounting location relative to the wheel, and comprises an endless loop self-tightening device positioned around the wheel.

Abstract: A method of cooling light emitting diode (LED) lighting systems and associated structures are disclosed and claimed herein. The method involves determining the areas of a printed circuit board (PCB) onto which LEDs will be mounted will have the highest temperature during operation and positioning thermal vias of a certain size in or adjacent that area. The thermal vias extend from the PCB first side through the PCB substrate to the PCB second side to allow fluid flow through the PCB. The thermal vias are coated with a plating so that thermal energy is conductively transferred from the area adjacent an LED or resistor to the thermal via. From the thermal via the thermal energy may be dissipated to the atmosphere adjacent the thermal via through various modes. Novel structures according to the present invention include LED circuits, light fixtures, PCBs, and various combinations thereof employing the thermal vias.