Abstract: Apparatus for dissipating heat during the operation of a device. In accordance with some embodiments, the apparatus compares spaced-apart first and second heat sources. A thermally conductive plate is disposed between the first and second heat sources. A thermal interface layer is contactingly disposed between the plate and the first heat source, and has a relatively higher thermal conductivity so that heat generated by the first heat source passes through the thermal interface layer and to the plate. A thermal barrier layer is contactingly disposed between the plate and the second heat source to mechanically support the plate relative to the second heat source. The thermal barrier layer has a relatively lower thermal conductivity to thermally isolate the conductive plate from the second heat source.

Abstract: Apparatus for dissipating heat during the operation of a device. In accordance with some embodiments, the apparatus compares spaced-apart first and second heat sources. A thermally conductive plate is disposed between the first and second heat sources. A thermal interface layer is contactingly disposed between the plate and the first heat source, and has a relatively higher thermal conductivity so that heat generated by the first heat source passes through the thermal interface layer and to the plate. A thermal barrier layer is contactingly disposed between the plate and the second heat source to mechanically support the plate relative to the second heat source. The thermal barrier layer has a relatively lower thermal conductivity to thermally isolate the conductive plate from the second heat source.

Abstract: Apparatus for dissipating heat during the operation of a device. In accordance with some embodiments, the apparatus compares spaced-apart first and second heat sources. A thermally conductive plate is disposed between the first and second heat sources. A thermal interface layer is contactingly disposed between the plate and the first heat source, and has a relatively higher thermal conductivity so that heat generated by the first heat source passes through the thermal interface layer and to the plate. A thermal barrier layer is contactingly disposed between the plate and the second heat source to mechanically support the plate relative to the second heat source. The thermal barrier layer has a relatively lower thermal conductivity to thermally isolate the conductive plate from the second heat source.

Abstract: Apparatus for dissipating heat during the operation of a device. In accordance with some embodiments, the apparatus compares spaced-apart first and second heat sources. A thermally conductive plate is disposed between the first and second heat sources. A thermal interface layer is contactingly disposed between the plate and the first heat source, and has a relatively higher thermal conductivity so that heat generated by the first heat source passes through the thermal interface layer and to the plate. A thermal barrier layer is contactingly disposed between the plate and the second heat source to mechanically support the plate relative to the second heat source. The thermal barrier layer has a relatively lower thermal conductivity to thermally isolate the conductive plate from the second heat source.

Abstract: The present disclosure relates to assessing coverage of a connection joint, such as a solder joint, between a device and a printed circuit board (PCB). In accordance with various embodiments, a PCB includes a conductive thermal pad adapted to be electrically and mechanically connected to an exposed pad of a component by an intervening connection joint to establish a thermal path to dissipate thermal energy from the component. An isolated test via that extends through the conductive thermal pad in non-contacting relation thereto, the test via adapted to mechanically and electrically contact said intervening connection joint. A coverage characteristic of the intervening connection joint can be determined in relation to application of an electrical signal to the test via.

Abstract: A data storage device comprises a data storage medium and a connector that provides an interface between the data storage medium and a host device. The connector has a shape that substantially conforms to an internal storage interconnect standard. The connector comprises a first set of electrical contacts that substantially conform to the internal storage interconnect standard, and a second set of contacts configured to provide connectivity with the host device in accordance with an external storage interconnect standard. Also described are cables for connecting the data storage device to a host via the external storage interconnect standard as well as an interconnect detector.

Abstract: A data storage device comprises a data storage medium; an interface between the data storage medium and a host device configured to provide connectivity according to a plurality of storage interconnect standards. The data storage device also includes a interconnect detector configured to determine the presence of a physical connection to the host device and identify an interconnect standard of the host device, wherein the interconnect standard of the host device is one of the plurality of storage interconnect standards; and a controller configured to: receive an indication of the interconnect standard of the physical connection from the interconnect detector, receive data access commands in accordance with the interconnect standard from the host device via the connector; process the data access commands by accessing the data storage medium; and send a response to the data access commands in accordance with the interconnect standard to the host via the connector.

Abstract: The present disclosure relates to assessing coverage of a connection joint, such as a solder joint, between a device and a printed circuit board (PCB). In accordance with various embodiments, a PCB includes a conductive thermal pad adapted to be electrically and mechanically connected to an exposed pad of a component by an intervening connection joint to establish a thermal path to dissipate thermal energy from the component. An isolated test via that extends through the conductive thermal pad in non-contacting relation thereto, the test via adapted to mechanically and electrically contact said intervening connection joint. A coverage characteristic of the intervening connection joint can be determined in relation to application of an electrical signal to the test via.

Abstract: A data storage device comprises a data storage medium; an interface between the data storage medium and a host device configured to provide connectivity according to a plurality of storage interconnect standards. The data storage device also includes a interconnect detector configured to determine the presence of a physical connection to the host device and identify an interconnect standard of the host device, wherein the interconnect standard of the host device is one of the plurality of storage interconnect standards; and a controller configured to: receive an indication of the interconnect standard of the physical connection from the interconnect detector, receive data access commands in accordance with the interconnect standard from the host device via the connector; process the data access commands by accessing the data storage medium; and send a response to the data access commands in accordance with the interconnect standard to the host via the connector.

Abstract: A data storage device comprises a data storage medium and a connector that provides an interface between the data storage medium and a host device. The connector has a shape that substantially conforms to an internal storage interconnect standard. The connector comprises a first set of electrical contacts that substantially conform to the internal storage interconnect standard, and a second set of contacts configured to provide connectivity with the host device in accordance with an external storage interconnect standard. Also described are cables for connecting the data storage device to a host via the external storage interconnect standard as well as an interconnect detector.