Abstract: Coating compositions may combine durability and stain resistance with reduced environmental emissions and health risks. A coating composition may comprise an isocyanate component, an amine-functional resin comprising an aspartic amine, a reactive silicone component having a molecular weight of at least of 500, and TiO2 in an amount of at least 5 wt. %. The coating composition may further comprise a cure retardant in an amount of at least 5 wt. % and a solvent in an amount of up to 20 wt. %.

Abstract: A pressurized closure assembly is provided which has a connector assembly to allow improved application of torque in limited space conditions to rotate a head away from the hub of the closure assembly.

Abstract: A pressurized closure assembly is provided which has a connector assembly to allow improved application of torque in limited space conditions to rotate a head away from the hub of the closure assembly.

Abstract: A pressurized closure assembly is provided which has a connector assembly to allow improved application of torque in limited space conditions to rotate a head away from the hub of the closure assembly.

Abstract: A grinder pump basin system is provided which includes a basin; a cover plate; a bracket secured to the cover plate; and a grinder pump with cutter plate with openings and a cutter blade secured to the bracket above a bottom surface of the basin. The openings in the cutter plate have an unique shape which assists in the cutting of material which flows through an inlet of a grinder pump. The shape of the cutter blade cooperates with the openings in the cutter plate such that solids are forced between these respective components and thereby are efficiently cut into small pieces for passing through the openings and for discharge from the grinder pump basin system.

Abstract: A sealed and self-contained tankless water heater flushing system including a holding basin, a cover lid for the holding basin firmly securable and sealed liquid tight to the holding basin, a submersible pump contained within the holding basin, a submersible pump hose, securable from the submersible pump within the holding basin to a discharge opening in the cover of the holding basin, a filter system, securable within the holding basin to a filter opening contained in the cover lid, wherein the filter system includes a filter for filtering solid substances from the tankless water heater during a flushing process, a discharge hose for connecting the discharge opening to the water heater, and a filter hose for connecting the filter opening to the water heater.

Abstract: A closure comprises a hub with a central opening and a head pivotally connected to the hub, the head sealing the central opening when in a closed position. A lip seal relief is defined by a stepped surface between the head and the hub so that when the head is closed, the relief or clearance is provided between the head and hub inhibiting damage to a seal.

Abstract: A closure comprises a hub with a central opening and a head positionable within the hub, the head sealing the central opening when in a closed position, a spool rotatable about a post extending from the head, wherein rotation of the spool causes axial movement of the spool along the post, a plurality of radial arms extending from the spool to a plurality of locking segments.

Abstract: A grinder pump basin system is provided which includes a basin; a cover plate; a bracket secured to the cover plate; and a grinder pump with cutter plate with openings and a cutter blade secured to the bracket above a bottom surface of the basin. The bracket includes a front portion, which prevents waste water from interacting adversely with the grinder pump when it enters the basin. A discharge system for the grinder pump is secured to an outlet of the grinder pump and includes a discharge pipe and a flexible discharge coupling. Flow directional jets are also provided in an elbow of the pump discharge system to direct waste water and solids away from the grinder pump.

Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

Abstract: A grinder pump basin system is provided which includes a basin; a cover plate; a bracket secured to the cover plate; and a grinder pump with cutter plate with openings and a cutter blade secured to the bracket above a bottom surface of the basin. The openings in the cutter plate have an unique shape which assists in the cutting of material which flows through an inlet of a grinder pump. The shape of the cutter blade cooperates with the openings in the cutter plate such that solids are forced between these respective components and thereby are efficiently cut into small pieces for passing through the openings and for discharge from the grinder pump basin system.

Abstract: A sealed and self-contained tankless water heater flushing system including a holding basin, a cover lid for the holding basin firmly securable and sealed liquid tight to the holding basin, a submersible pump contained within the holding basin, a submersible pump hose, securable from the submersible pump within the holding basin to a discharge opening in the cover of the holding basin, a filter system, securable within the holding basin to a filter opening contained in the cover lid, wherein the filter system includes a filter for filtering solid substances from the tankless water heater during a flushing process, a discharge hose for connecting the discharge opening to the water heater, and a filter hose for connecting the filter opening to the water heater.

Abstract: A grinder pump basin system is provided which includes a basin; a cover plate; a bracket secured to the cover plate; and a grinder pump with cutter plate with openings and a cutter blade secured to the bracket above a bottom surface of the basin. The bracket includes a front portion, which prevents waste water from interacting adversely with the grinder pump when it enters the basin. A discharge system for the grinder pump is secured to an outlet of the grinder pump and includes a discharge pipe and a flexible discharge coupling. Flow directional jets are also provided in an elbow of the pump discharge system to direct waste water and solids away from the grinder pump.

Abstract: A system, method, and apparatus are included for providing additional space between an integrated circuit package and a circuit board. An integrated circuit package is provided including a plurality of integrated circuit package contacts. Also provided is a circuit board in electrical communication with the integrated circuit package. Further, the integrated circuit package, the integrated circuit contacts, and/or the circuit board is configured for providing additional space between the integrated circuit package and the circuit board to position at least a portion of at least one component between the integrated circuit package and the circuit board.

Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

Abstract: A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon.

Abstract: A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon.

Abstract: A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon.

Abstract: An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.

Abstract: An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.