Abstract: Emulsion-based and micromolded (“MM”) or three dimensional printed (“3DP”) polymeric formulations for single injection of antigen, preferably releasing at two or more time periods, have been developed. Formulations are preferably formed of biocompatible, biodegradable polymers. Discrete regions encapsulating antigen, alone or in combination with other antigens, adjuvants, stabilizers, and release modifiers, are present in the formulations. Antigen is preferably present in excipient at the time of administration, or on the surface of the formulation, for immediate release, and incorporated within the formulation for release at ten to 45 days after initial release of antigen, optionally at ten to 90 day intervals for release of antigen in one or more additional time periods. Antigen may be stabilized through the use of stabilizing agents such as trehalose glass. In a preferred embodiment for immunization against polio, antigen is released at the time of administration, and two, four and six months thereafter.

Abstract: In some embodiments, an electronic device presents media items from different media applications in a unified media browsing application. In some embodiments, an electronic device facilitates browsing of media from different media applications based on category of media (e.g., movies, television shows, etc.). In some embodiments, an electronic device facilitates setup of a unified media browsing application that presents media items from different media applications in a unified media browsing user interface. In some embodiments, an electronic device displays multiple episodes of a collection of episodic content (e.g., a television series) in a user interface for the collection of episodic content. In some embodiments, an electronic device displays representations of, and provides access to, live-event media items accessible on the electronic device.

Abstract: A superconductor device includes a high superconductivity transition temperature enhanced from the raw material transition temperature. The superconductor device includes a matrix material and a core material. The enhancing matrix material and the core material together create a system of strongly coupled carriers. A plurality of low-dimensional conductive features can be embedded in the matrix. The low-dimensional conductive features (e.g., nanowires or nanoparticles) can be conductors or superconductors. An interaction between electrons of the low-dimensional conductive features and the enhancing matrix material can promote excitations that increase a superconductivity transition temperature of the superconductor device.

Abstract: A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in a vertically-stacked configuration. Each one of the end walls includes at least one slot that is configured to receive the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. Each one of the end walls also includes a plurality of lead guides that are configured to guide the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure.

Abstract: A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in a vertically-stacked configuration. Each one of the end walls includes at least one slot that is configured to receive the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. Each one of the end walls also includes a plurality of lead guides that are configured to guide the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure.

Abstract: One aspect includes an electronics assembly, including: (1) printed wiring board, (2) a mount and (3) a fastener for securing the printed wiring board to the mount, the fastener including a body configured to pass through a mounting hole on the printed wiring board and engage the mount, the fastener further including a conical head configured to receive a driver torque and further configured to engage a rim of the mounting hole and produce an increasing frictional torque to countervail and eventually balance the driver torque.

Abstract: One aspect of this disclosure provides an electrical connector pin for a printed wiring board. This embodiment includes an unmachined, collar having an acircular configuration and including a side wall. This embodiment further includes a machined first cylindrical connector shaft integrally formed with the collar and extending from collar along the longitudinal axis, and a machined second cylindrical connector shaft integrally formed with the collar and extending from the collar and along the longitudinal axis in a direction opposite to that of the first cylindrical connector shaft.

Abstract: There is provided electrical contact for circuit boards. Each leg of the pin section has a deformable segment that can expand or contract along the direction of the leg to alleviate stress created by relative movement of printed circuit boards and/or off-board components interconnected thereby. The deformable segments have members that project in opposing directions relative to the direction of the leg, so that the segments are symmetrical. In one embodiment, each leg has a deformable segment having a outwardly curved shape. In another embodiment, each leg has a deformable segment in the shape of a rectangular frame. The deformable segments define at least one opening where the two legs of the pin section are not overlapping, which breaks the capillary flow of solder between the legs. The amount of solder that flows into the electrical contact is selectively controlled by the selected placement of the deformable segments.

Abstract: A magnetic device is provided that may be employed with surface mount technology. In an advantageous embodiment, the magnetic device includes a magnetic core having a magnetic core half and a springable winding positioned about at least a portion of the magnetic core half. The springable winding includes a terminus biased against the magnetic core half.

Abstract: The present invention is directed to novel polypeptides and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptide molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention and to methods for producing the polypeptides of the present invention.

Abstract: The present invention is directed to novel polypeptides and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptide molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention and to methods for producing the polypeptides of the present invention.

Abstract: The present invention is directed to novel polypeptides and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptide molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention and to methods for producing the polypeptides of the present invention.

Abstract: A magnetic device and a method of manufacturing the same. In one embodiment, the device includes: (1) a magnetic core and (2) a winding structure located proximate the magnetic core. The winding structure includes:(2a) a multilayer main circuit board containing an interconnected first plurality of winding layers, (2b) a multilayer overlay board located proximate the main circuit board and containing an interconnected second plurality of winding layers and (2c) conductors coupling the first and second pluralities of winding layers together to cause the first and second pluralities of winding layers to function cooperatively as windings for the magnetic device.

Abstract: An inter-substrate conductive mount for a surface mountable circuit board, a method of manufacturing the circuit board and a surface mountable power magnetic device. In one embodiment, the circuit board includes: (1) a substrate, (2) an inter-substrate conductive mount composed of a material having a melting point above a solder reflow temperature and including a compliant solder joint at an interface of the substrate and (3) a solder located proximate the conductive mount, the conductive mount of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the conductive mount in contact with the substrate as the solder is brought to the reflow temperature, the conductive mount being capable of mounting the substrate to an adjacent substrate and providing a conductive path therebetween.

Abstract: The present invention provides a method for soldering components to a printed wiring board. In one embodiment, the method comprises applying a substantially lead-free solder to the printed wiring board, placing an electronic component having lead-free terminals on the solder, and heating the printed wiring board in a substantially oxygen-free atmosphere to a temperature sufficient to reflow the solder. In an alternative embodiment, the method may further comprise applying a tin-based solder. In a particularly advantageous embodiment, the method includes applying a solder alloy of tin and a metal selected from the group consisting of: silver, antimony, copper, and gold.

Abstract: An edge-mountable integrated circuit (IC) package and methods of manufacturing and assembling the same onto a printed wiring board (PWB). In one embodiment, the package includes: (1) a substrate having a major surface and a substantially planar edge and (2) a conductive coating having a first region located on a portion of the major surface and a second region located on a portion of the substantially planar edge, the second region being substantially planar to allow the second region to be reflow soldered to the adjoining printed wiring board PWB.

Abstract: An anvil for a press for assembling a fastener to a plate having an aperture. The press includes a ram assembly for pressing the fastener into the plate aperture. The anvil includes a housing and a pin disposed in the housing. The pin is slidable between an extended position, partially extending outwardly of the housing and is adapted to extend through the plate aperture. The pin moves to a retracted position disposed within the housing for contact with the bottom surface of the plate. The anvil further includes a collar disposed in the housing and concentrically disposed around the pin. The collar includes a plurality of spaced apart collar sections, each collar section having a bottom flange retained by the housing and a top flange. The collar sections are movable between an expanded position when the pin is in the extended position, and a collapsed position when the pin is in the retracted position within the housing.

Abstract: A surface mountable power supply and a method of manufacturing the power supply.

Abstract: A surface mount package for containing a board-mounted power supply, a method of manufacturing the same and a board-mounted power supply employing the package. In one embodiment, the package includes: (1) a plurality of leads having first ends and second, surface mount ends, (2) a dielectric lead frame that retains the plurality of leads in predetermined positions relative to one another such that at least some of the second, surface mount ends are co-planar, the first ends couplable to the board-mounted power supply, (3) a shell, coupled to the lead frame, that forms a portion of a periphery of the surface mount package and (4) potting material located between the lead frame and the shell.