Abstract: A superconductor device includes a high superconductivity transition temperature enhanced from the raw material transition temperature. The superconductor device includes a matrix material and a core material. The enhancing matrix material and the core material together create a system of strongly coupled carriers. A plurality of low-dimensional conductive features can be embedded in the matrix. The low-dimensional conductive features (e.g., nanowires or nanoparticles) can be conductors or superconductors. An interaction between electrons of the low-dimensional conductive features and the enhancing matrix material can promote excitations that increase a superconductivity transition temperature of the superconductor device.

Abstract: A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in a vertically-stacked configuration. Each one of the end walls includes at least one slot that is configured to receive the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. Each one of the end walls also includes a plurality of lead guides that are configured to guide the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure.

Abstract: A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in a vertically-stacked configuration. Each one of the end walls includes at least one slot that is configured to receive the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. Each one of the end walls also includes a plurality of lead guides that are configured to guide the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure.

Abstract: One aspect includes an electronics assembly, including: (1) printed wiring board, (2) a mount and (3) a fastener for securing the printed wiring board to the mount, the fastener including a body configured to pass through a mounting hole on the printed wiring board and engage the mount, the fastener further including a conical head configured to receive a driver torque and further configured to engage a rim of the mounting hole and produce an increasing frictional torque to countervail and eventually balance the driver torque.

Abstract: One aspect of this disclosure provides an electrical connector pin for a printed wiring board. This embodiment includes an unmachined, collar having an acircular configuration and including a side wall. This embodiment further includes a machined first cylindrical connector shaft integrally formed with the collar and extending from collar along the longitudinal axis, and a machined second cylindrical connector shaft integrally formed with the collar and extending from the collar and along the longitudinal axis in a direction opposite to that of the first cylindrical connector shaft.

Abstract: There is provided electrical contact for circuit boards. Each leg of the pin section has a deformable segment that can expand or contract along the direction of the leg to alleviate stress created by relative movement of printed circuit boards and/or off-board components interconnected thereby. The deformable segments have members that project in opposing directions relative to the direction of the leg, so that the segments are symmetrical. In one embodiment, each leg has a deformable segment having a outwardly curved shape. In another embodiment, each leg has a deformable segment in the shape of a rectangular frame. The deformable segments define at least one opening where the two legs of the pin section are not overlapping, which breaks the capillary flow of solder between the legs. The amount of solder that flows into the electrical contact is selectively controlled by the selected placement of the deformable segments.

Abstract: A magnetic device is provided that may be employed with surface mount technology. In an advantageous embodiment, the magnetic device includes a magnetic core having a magnetic core half and a springable winding positioned about at least a portion of the magnetic core half. The springable winding includes a terminus biased against the magnetic core half.

Abstract: The present invention is directed to novel polypeptides and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptide molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention and to methods for producing the polypeptides of the present invention.

Abstract: The present invention is directed to novel polypeptides and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptide molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention and to methods for producing the polypeptides of the present invention.

Abstract: The present invention is directed to novel polypeptides and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptide molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention and to methods for producing the polypeptides of the present invention.

Abstract: A magnetic device and a method of manufacturing the same. In one embodiment, the device includes: (1) a magnetic core and (2) a winding structure located proximate the magnetic core. The winding structure includes:(2a) a multilayer main circuit board containing an interconnected first plurality of winding layers, (2b) a multilayer overlay board located proximate the main circuit board and containing an interconnected second plurality of winding layers and (2c) conductors coupling the first and second pluralities of winding layers together to cause the first and second pluralities of winding layers to function cooperatively as windings for the magnetic device.

Abstract: An inter-substrate conductive mount for a surface mountable circuit board, a method of manufacturing the circuit board and a surface mountable power magnetic device. In one embodiment, the circuit board includes: (1) a substrate, (2) an inter-substrate conductive mount composed of a material having a melting point above a solder reflow temperature and including a compliant solder joint at an interface of the substrate and (3) a solder located proximate the conductive mount, the conductive mount of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the conductive mount in contact with the substrate as the solder is brought to the reflow temperature, the conductive mount being capable of mounting the substrate to an adjacent substrate and providing a conductive path therebetween.

Abstract: The present invention provides a method for soldering components to a printed wiring board. In one embodiment, the method comprises applying a substantially lead-free solder to the printed wiring board, placing an electronic component having lead-free terminals on the solder, and heating the printed wiring board in a substantially oxygen-free atmosphere to a temperature sufficient to reflow the solder. In an alternative embodiment, the method may further comprise applying a tin-based solder. In a particularly advantageous embodiment, the method includes applying a solder alloy of tin and a metal selected from the group consisting of: silver, antimony, copper, and gold.

Abstract: An edge-mountable integrated circuit (IC) package and methods of manufacturing and assembling the same onto a printed wiring board (PWB). In one embodiment, the package includes: (1) a substrate having a major surface and a substantially planar edge and (2) a conductive coating having a first region located on a portion of the major surface and a second region located on a portion of the substantially planar edge, the second region being substantially planar to allow the second region to be reflow soldered to the adjoining printed wiring board PWB.

Abstract: An anvil for a press for assembling a fastener to a plate having an aperture. The press includes a ram assembly for pressing the fastener into the plate aperture. The anvil includes a housing and a pin disposed in the housing. The pin is slidable between an extended position, partially extending outwardly of the housing and is adapted to extend through the plate aperture. The pin moves to a retracted position disposed within the housing for contact with the bottom surface of the plate. The anvil further includes a collar disposed in the housing and concentrically disposed around the pin. The collar includes a plurality of spaced apart collar sections, each collar section having a bottom flange retained by the housing and a top flange. The collar sections are movable between an expanded position when the pin is in the extended position, and a collapsed position when the pin is in the retracted position within the housing.

Abstract: A surface mountable power supply and a method of manufacturing the power supply.

Abstract: A surface mount package for containing a board-mounted power supply, a method of manufacturing the same and a board-mounted power supply employing the package. In one embodiment, the package includes: (1) a plurality of leads having first ends and second, surface mount ends, (2) a dielectric lead frame that retains the plurality of leads in predetermined positions relative to one another such that at least some of the second, surface mount ends are co-planar, the first ends couplable to the board-mounted power supply, (3) a shell, coupled to the lead frame, that forms a portion of a periphery of the surface mount package and (4) potting material located between the lead frame and the shell.

Abstract: A bullet sizing die is releasably positioned at one end of a hollow die body in a bullet reloading press, the die having an internal diameter corresponding to the desired caliber of a bullet to be sized, each bullet being placed on a plunger so that axial advancement of the plunger will force each bullet in succession through the die and eject it from the die body as each next bullet in succession is advanced through the die. In a modified form, semi-spherical dies are interchangeably mounted in facing relation to one another between the plunger and die body for the sizing of lead shot.

Abstract: An adapter unit permitting installation of multiple pay telephone units on an existing telephone post that is designed to support only one or two telephone units, is disclosed. The adapter unit is provided with a hollow, rectangular, box housing having four sides, a closed top end and an open bottom end. One of the sides of the adapter is releasably secured to an existing telephone post via integral brackets leaving the remaining three sides of the housing exposed. Each of the three exposed sides is provided with spaced, adjustable length, bolts extending therefrom to permit attachment of individual pay phone mounting fixtures thereto. An adjustable length support leg has a first end slidably received within the hollow housing and is provided with a ground contact plate on the other end thereof. Height adjustment bracket is provided for the support leg inside the open hollow housing to permit height adjustment of the support leg for diverse or non-level terrain.